DOWSIL™ TC-5121C LV Thermally Conductive Compound

  • Polymer matrix helps reduce pump out
  • Fluid
  • Good thermal conductivity
  • Low thermal resistance
  • Does not polymerize
  • Heat removal from PCB system components
  • Possible to obtain bond line thickness (BLT).

Additional information

Product Type
Brand
Technology
Base
Dielectric strength (kV/mm)
Viscosity
Color
Range termico operativo
Thermal conductivity , ,
Applications ,