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Thermal interface

Showing all 10 results

Product type

3 Electronics adhesive Electronics adhesive
1 Gap filler Gap filler
5 Heat-conductive adhesive Heat-conductive adhesive
1 Resins and encapsulants Resins and encapsulants

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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
- Mellow
- High tensile strength and elongation resistance
- High thermal stability
- Single component - Does not require mixing
- Polymerization at room temperature
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
- Mellow
- Polymerization in rapid RTV
- Good "green" resistance
- Single-component - No mixing required
- Polymerization at room temperature
- Fast skin time
- High self-extinguishing
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DOWSIL™ DA-6534 Adhesive
- Low ionic impurities
- Very high thermal conductivity
- Loaded silver
- Good adhesion to Ni, Al, laminate and silicon
- Microelectronic grade material
- High electroconductive performance
- Good adhesive performance for TIM1 applications
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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DOWSIL™ TC-4515 Gap Filler A&B
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
- Polymer matrix helps reduce pump out
- Fluid
- Good thermal conductivity
- Low thermal resistance
- Does not polymerize
- Heat removal from PCB system components
- Possible to obtain bond line thickness (BLT).
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DOWSIL™ TC-5622 Thermally Conductive Compound
- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
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SYLGARD™ Q3-3600 Thermally Conductive Encapsulant
- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability

Thermal interface

Filtri

Product type

Brands

Technology

Applications

DOWSIL™ 3-6753 Thermally Conductive Adhesive

DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant

DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant

DOWSIL™ DA-6534 Adhesive

DOWSIL™ SE 4486 Thermally Conductive Adhesive

DOWSIL™ TC-4515 Gap Filler A&B

DOWSIL™ TC-5026 Thermally Conductive Compound

DOWSIL™ TC-5121C LV Thermally Conductive Compound

DOWSIL™ TC-5622 Thermally Conductive Compound

SYLGARD™ Q3-3600 Thermally Conductive Encapsulant

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