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Filtri

Tipo di prodotto
- 6 Conformal coating
- 2 Electronics adhesive
- 1 Gel
- 2 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
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- When properly mixed, the gel is green
- Conditional adhesion without primer at room temperature
- Hardened gel for increased mechanical strength
- UV indicator enables automatic inspection
- Increased flame resistance
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- Single-component
- Does not require mixing
- Good fluidity
- Capable of flowing, filling or self-leveling
- Polymerization at room temperature
- No solvent added
- UV indicator for manual and automatic inspections
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- Mellow
- High elongation by stress reduction
- Single-component - No mixing required
- Polymerization at room temperature
- High self-extinguishing
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- Provides excellent adhesion to all substrates
- Good temperature range and dielectric properties
- Can be welded through the UV track for easy inspection
- Can be removed with solvents such as Ultrasolve (ULS)
- Cheap
- Enables efficient application
- Fast drying time
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- Alkyd conformal coating
- Low VOC
- Specific for the protection of electronic circuits
- Suitable for use in extreme temperatures
- Better performance at high temperatures
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- Allows the PCB design to be camouflaged
- High resistance to chemicals and solvents
- Extremely wide operating temperature range
- Resistant to solvents from the automotive and aerospace industries
- The hardened coating can be removed with Electrolube
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- Minimizes circuit board design
- High resistance to chemicals and solvents
- Extremely wide operating temperature range
- Resistant to solvents in aerospace and automotive industries
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- High resistance to surface insulation
- Good resistance to wet environments
- Flexible coating
- Good resistance to a wide and variable temperature range
- Ideal for applications requiring rework
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- Excellent performance in a wide range of harsh conditions
- Approved in the military
- Transparent coating with excellent clarity
- Ideal for LED and UV-exposed applications
- High adhesion to a wide variety of substrates
- Resistant to mold growth
- Ideal for applications requiring rework
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Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability








