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🧭 Where you are: mascherpa.it » Electronics

Electronics

Home Electronics

Mostra Nascondi Filtri

Showing 1–20 of 112 results

Filtri

Product type

1 Conductive paints Conductive paints
19 Conformal coating Conformal coating
5 Electrically conductive adhesives Electrically conductive adhesives
16 Electronics adhesive Electronics adhesive
2 Gap filler Gap filler
8 Gel Gel
4 Greases Greases
10 Heat-conductive adhesive Heat-conductive adhesive
31 Resins and encapsulants Resins and encapsulants
6 Thermal conductive paste Thermal conductive paste

Brands

Technology

Technology

Applications

Applications

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Araldite® CW 2243-1L
- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
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Araldite® CW 2245
- Good resistance to temperature shock
- Flexible jets
- Low viscosity
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Araldite® CY 221 / Aradur® HY 2966
- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
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Araldite® DBF
- Low viscosity casting resin
- High possibility of adding filler
- Encapsulation of electronic and low-voltage components
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Araldite® XB 2252-1 / XB 2253-1
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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Arathane® CW 5620
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
- Two-component resin for high temperature
- It cross-links at room temperature but can be accelerated with heat
- Halogen-free system
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Arathane® Vb U 6912 P Polyol / Vb U001/B Isocian
- Polymerization at room temperature or moderate heat
- Easy castability and impregnation
- Mixing ratio 100:23 by weight
- Excellent electrical properties
- Absorbs sudden thermal shock
- Suitable for a low-stress encapsulant
- Halogen free
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DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Single-component solvent-based resin coating
- Polymerization at room temperature
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2577 Low VOC Conformal Coating
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- The optional thermal acceleration (after solvent wilting)
- UV indicator enables automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emission recovery can be simplified for VOCs in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to a robust surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- Possibility of acceleration after solvent spillage
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low viscosity improves flow and
- fill tight spaces and gaps
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DOWSIL™ 1-2620 Low VOC Conformal Coating
- Medium viscosity
- Low VOC content
- Abrasion resistance
- Good dielectric properties
- Good adhesion to many substrates
- Polymerization at room temperature
- Stable and flexible over a wide temperature range
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Hot polymerization
- Good thermal conductivity values
- No solvent added
- Single-component - No need to mix separate components
- Fast and versatile polymerization controlled by temperature
- Fills and self-levels after dispensing
- Heat dissipation from PCB systems to increase reliability
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DOWSIL™ 3-1944 RTV Coating
- Single-component, does not require mixing
- Good fluidity
- After dispensing, it is capable of flowing, filling or self-leveling
- Faster inline machining with optional thermal acceleration
- No solvent added
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
- UV indicator enables automatic inspection
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DOWSIL™ 3-1953 Conformal Coating
- No solvent added
- Polymerization at room temperature
- Slight thermal acceleration can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
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DOWSIL™ 3-1965 Conformal Coating
- No solvent added
- Polymerization at room temperature
- It can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Improves reliability against stresses
- Promotes flow and filling of narrow spaces and crevices
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DOWSIL™ 3-4150 Dielectric Gel Kit
- Green when mixed
- Rapid polymerization at room temperature
- Reduces the risk of loading errors
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DOWSIL™ 3-4207 Dielectric Tough Gel Kit
- When properly mixed, the gel is green
- Conditional adhesion without primer at room temperature
- Hardened gel for increased mechanical strength
- UV indicator enables automatic inspection
- Increased flame resistance
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DOWSIL™ 3-4241 Dielectric Tough Gel Kit
- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Good mechanical strength
- Contains UV indicator for inspection
- Adhesion without the use of primer
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
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DOWSIL™ 3-6371 UV Gel
- UV curing in 1 part
- Very soft
- Suitable for very low temperatures
- Does not require mixing
- UV rays for fast processing speed
- Polymerization secondary to moisture
- The gel remains flexible even at very low temperatures

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