Prodotti per Categoria Electronics

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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DOWSIL™ EC-6601 Electrically Conductive Adhesive
- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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DOWSIL™ EC-8425
- High electrical conductivity (silver-based filler)
- Electromagnetic shielding (EMC) over a wide frequency range
- High elongation for stress relief (>20%)
- Non-slump adhesive (non-flowable)
- UV traceability for inspection
- Good adhesion on various substrates
- Solvent-free formulation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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DOWSIL™ Q5-8401 Adhesive
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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DOWSIL™ SC 102 Compound
- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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DOWSIL™ SE 1700 Adhesive
- Mellow
- Two-component - 10:1 mixing ratio
- High tensile strength
- Good processing time after mixing
- Hot polymerization
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DOWSIL™ SE 4420
- Polymerization at room temperature
- Good adhesion on various substrates
- Fast tack-free time
- Elastomeric material with high elongation
- Suitable for bonding, sealing and thermal dissipation
- Good mechanical strength
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9120 S
- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
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DOWSIL™ SE 9157 Conformal Coating
- Rapid polymerization in RT, without notches
- Medium viscosity
- Polymerizes into a soft, low-stress elastomer
- Without added solvents
- Slight thermal acceleration can speed up in-line processing
- Soft coating can improve reliability against stresses
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DOWSIL™ SE 9184 RTV Adhesive
- Rapid polymerization in RT, without notches
- Not smooth
- Higher thermal conductivity
- Controlled volatility of silicone
- No mixing required
- Polymerization at room temperature
- Faster processing at room temperature
- Used if increased flame resistance is required
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DOWSIL™ SE 9185
- Rapid polymerization in RT
- Mellow
- High elongation
- Controlled volatility of silicone
- Single-component - No mixing required
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DOWSIL™ SE 9186 Sealant
- Volatility-controlled silicone
- Polymerizes into a soft and elastic elastomer
- No solvent added
- Single-component - No mixing required
- Polymerization at room temperature
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DOWSIL™ SE 9187 L Adhesive
- Rapid polymerization
- Very low viscosity
- Controlled volatility of silicone
- Solvent-free
- Excellent smoothness, filling or self-leveling after distribution
- Polymerizes into a soft, low-stress elastomer
- Coating can improve reliability against stresses
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DOWSIL™ SE 9188 RTV Adhesive
- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0
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DOWSIL™ SE 9189 L RTV
- Rapid polymerization
- Sliding
- Polymerizes into a soft, low-stress elastomer
- Controlled volatility of silicone
- No solvent added
- Polymerization at room temperature
- Faster processing at room temperature with thermal acceleration
- Soft coating can improve reliability against stresses
- Can be used if flame resistance required
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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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DOWSIL™ TC-4515 Gap Filler A&B
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance