Electronics

Mostra Nascondi Filtri

Showing 21–40 of 129 results

  • DOWSIL™ 3-4241 Dielectric Tough Gel Kit
    Read more Quick View

    DOWSIL™ 3-4241 Dielectric Tough Gel Kit
    • Slow-curing two-component silicone dielectric gel
    • Good flame resistance
    • Good mechanical strength
    • Contains UV indicator for inspection
    • Adhesion without the use of primer
    • Cures extremely softly
    • Designed to insulate circuits from the damaging effects of moisture
    • Provides electrical insulation for high voltages
    • Protects circuits and interconnections from thermal stresses
    • Low viscosity
    • Odorless
  • DOWSIL™ 3-6265 HP Adhesive
    Read more Quick View

    DOWSIL™ 3-6265 HP Adhesive
    • Black one-component silicone adhesive
    • Thixotropic and non-sagging
    • Thermal addition cure polymerization
    • High tensile strength
    • Reduced void formation after curing, even on sensitive substrates
    • UL 94 V-0 rated
  • DOWSIL™ 3-6371 UV Gel
    Read more Quick View

    DOWSIL™ 3-6371 UV Gel
    • UV curing in 1 part
    • Very soft
    • Suitable for very low temperatures
    • Does not require mixing
    • UV rays for fast processing speed
    • Polymerization secondary to moisture
    • The gel remains flexible even at very low temperatures
  • DOWSIL™ 3-6753 Thermally Conductive Adhesive
    Read more Quick View

    DOWSIL™ 3-6753 Thermally Conductive Adhesive
    • Mixing ratio: 1 to 1
    • Highly fluent
    • Self-leveling
    • Versatile thermal polymerization
    • Ensures heat flow away from components
    • With 7 mil glass microspheres
    • Check the thickness of the adhesion line
    • Without added solvents
  • DOWSIL™ 3140 RTV Coating
    Read more Quick View

    DOWSIL™ 3140 RTV Coating
    • Single-component
    • Does not require mixing
    • Good fluidity
    • Capable of flowing, filling or self-leveling
    • Polymerization at room temperature
    • No solvent added
    • UV indicator for manual and automatic inspections
  • DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
    Read more Quick View

    DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
    • Mellow
    • High tensile strength and elongation resistance
    • High thermal stability
    • Single component - Does not require mixing
    • Polymerization at room temperature
  • DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
    Read more Quick View

    DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
    • Mellow
    • Polymerization in rapid RTV
    • Good "green" resistance
    • Single-component - No mixing required
    • Polymerization at room temperature
    • Fast skin time
    • High self-extinguishing
  • DOWSIL™ 340 Heat Sink Compound
    Read more Quick View

    DOWSIL™ 340 Heat Sink Compound
    • Not smooth
    • Moderate thermal conductivity
    • Does not require ovens or curing
    • Heat flow away from circuit components can increase reliability
  • DOWSIL™ 3810 EG
    Read more Quick View

    DOWSIL™ 3810 EG
    • One-part dielectric gel
    • Transparent
    • Hot polymerization
    • Low viscosity
    • Very soft gel
    • Suitable for PCB potting and electronic component protection
    • Electrical insulation and environmental protection
    • Extended temperature range (-60°C / +200°C)
    • No mixing required
  • DOWSIL™ 4535
    Read more Quick View

    DOWSIL™ 4535
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
  • DOWSIL™ 5351
    Read more Quick View

    DOWSIL™ 5351
    • Non-curing
    • High thermal conductivity
    • Stable on vertical surfaces
    • Gap filling capacity up to 1.0 mm
    • Thermally conductive silicone material
    • Low thermal resistance and good high-temperature stability
  • DOWSIL™ 5515
    Read more Quick View

    DOWSIL™ 5515
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
  • DOWSIL™ 5888
    Read more Quick View

    DOWSIL™ 5888
    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses
  • DOWSIL™ 739 Plastic Adhesive
    Read more Quick View

    DOWSIL™ 739 Plastic Adhesive
    • Mellow
    • High elongation by stress reduction
    • Single-component - No mixing required
    • Polymerization at room temperature
    • High self-extinguishing
  • DOWSIL™ 744 RTV Adhesive Sealant
    Read more Quick View

    DOWSIL™ 744 RTV Adhesive Sealant
    • Cures at room temperature
    • Pasty consistency
    • It does not drip
    • Easy to apply
    • High elongation
    • Stable and flexible over a wide temperature range
  • DOWSIL™ 866 Primerless Silicone Adhesive
    Read more Quick View

    DOWSIL™ 866 Primerless Silicone Adhesive
    • Hot polymerization
    • High tensile strength
    • Single component - Does not require mixing
    • Fast and versatile curing with heat input fill or self-leveling after deployment
  • DOWSIL™ 93-076 RF Aerospace Sealant
    Read more Quick View

    DOWSIL™ 93-076 RF Aerospace Sealant
    Good tensile strength High adhesive capacity Low thermal conductivity Good weather resistance Two-component with room temperature curing Stable even at high temperatures
  • DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
    Read more Quick View

    DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
    • Two-part silicone elastomer encapsulant
    • Low thermal vacuum outgassing
    • Physical and electrical stability
    • Wide operating temperature range.
    • Certified to NASA requirements for extreme environment applications.
  • DOWSIL™ CC 2588
    Read more Quick View

    DOWSIL™ CC 2588
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
  • DOWSIL™ CC 8030 UV
    Read more Quick View

    DOWSIL™ CC 8030 UV
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition