Industries

Mostra Nascondi Filtri

Showing 1–20 of 56 results

  • ARALDITE® 1570 FST A/B
    Read more Quick View

    ARALDITE® 1570 FST A/B
    • Two-component epoxy adhesive
    • Halogen-free
    • Compliant with FST (Flame, Smoke, Toxicity) requirements
    • Self-extinguishing
    • Thixotropic paste formulation
    • Room temperature curing
  • ARALDITE® 1641 A/B
    Read more Quick View

    ARALDITE® 1641 A/B
    • Ultra-low density syntactic epoxy adhesive
    • Easily pumpable
    • Non-sag after application
    • Good resistance to vibrational fatigue
    • Designed to reduce cracking tendency in high-stress applications
  • ARALDITE® 1644 A/B
    Read more Quick View

    ARALDITE® 1644 A/B
    • Ultra-low density syntactic epoxy adhesive
    • Non-sag
    • Designed for edge sealing and void filling
    • High compressive strength-to-density ratio
    • Manual or extrusion application
  • ARALDITE® 40002/40003
    Read more Quick View

    ARALDITE® 40002/40003
    • Two-component epoxy system
    • FST Properties (Fire, Smoke, Toxicity)
    • Intrinsically flame retardant
    • Low viscosity for infusion and RTM processes
    • Heat curing
    • High mechanical performance
  • ARALDITE® 501 A/B
    Read more Quick View

    ARALDITE® 501 A/B
    • Two-component epoxy adhesive
    • Low-viscosity system
    • Good substrate wetting
    • Room temperature curing
  • ARALDITE® LY 1564 SP / ARADUR® 2954
    Read more Quick View

    ARALDITE® LY 1564 SP / ARADUR® 2954
    • Two-component epoxy system for composites
    • Amine system without reactive diluents
    • High flexibility and high reactivity
    • Suitable for hot processes
    • Good reinforcement impregnation
  • ARALDITE® LY 3508 / ARADUR® 22962
    Read more Quick View

    ARALDITE® LY 3508 / ARADUR® 22962
    • Toughened two-component epoxy system
    • Medium resin viscosity
    • Good toughness combined with low viscosity
    • Suitable for lamination and molding processes
    • Heat curing
  • ARALDITE® LY 3508 / ARADUR® 3475
    Read more Quick View

    ARALDITE® LY 3508 / ARADUR® 3475
    • Two-component epoxy system
    • Medium-viscosity toughened resin
    • Good toughness and mechanical strength
    • Suitable for lamination and molding processes
    • Heat curing
  • ARALDITE® LY 5052 / ARADUR® 5052
    Read more Quick View

    ARALDITE® LY 5052 / ARADUR® 5052
    • Two-component low-viscosity epoxy system
    • Long pot life
    • Good reinforcement impregnation
    • Room temperature curing with post-cure capability
  • ARALDITE® LY 8615 / ARADUR® 8615
    Read more Quick View

    ARALDITE® LY 8615 / ARADUR® 8615
    • Two-component high-temperature epoxy system
    • Low viscosity for RTM, SCRIMP, and VARTM processes
    • Long pot life
    • High glass transition temperature (Tg > 180 °C with post-cure)
    • Suitable for the production of composite parts and molds
  • CG 1305 A/B
    Read more Quick View

    CG 1305 A/B
    • Two-component syntactic epoxy system
    • Medium density and low specific weight
    • High mechanical strength
    • Pourable
    • Designed for honeycomb structure reinforcement and potting
  • DOWSIL™ 1-4105 Conformal Coating
    Read more Quick View

    DOWSIL™ 1-4105 Conformal Coating
    • Single-component silicone conformal coating
    • Transparent
    • Thermal polymerization
    • Designed for the protection of rigid and flexible printed circuit boards.
    • Low viscosity
    • Without added solvents
    • Cures into a soft, low-stress elastomer, reducing stress on electronic components.
    • Incorporates a UV indicator to facilitate automated inspection
    • UL, IPC and MIL certified.
  • DOWSIL™ 3-6265 HP Adhesive
    Read more Quick View

    DOWSIL™ 3-6265 HP Adhesive
    • Black one-component silicone adhesive
    • Thixotropic and non-sagging
    • Thermal addition cure polymerization
    • High tensile strength
    • Reduced void formation after curing, even on sensitive substrates
    • UL 94 V-0 rated
  • DOWSIL™ 3-6548 Silicone RTV Foam
    Read more Quick View

    DOWSIL™ 3-6548 Silicone RTV Foam
    • Two-component fire-resistant RTV silicone foam
    • Two-component room temperature vulcanizing (RTV) silicone foam
    • Fire resistant
    • Good flexibility even under severe operating conditions
    • Withstand high temperatures
    • Designed to limit hazards such as smoke, flames and gases.
    • Expands and cures at room temperature to form a closed-cell foam elastomer.
    • Designed for creating fire-resistant seals in penetrations and linear joints.
  • DOWSIL™ 6-1125 Controlled Volatility Sealant
    Read more Quick View

    DOWSIL™ 6-1125 Controlled Volatility Sealant
    • One-part condensation cure silicone sealant
    • Space grade
    • Non-sag
    • Low controlled volatility
    • Cures at room temperature upon exposure to moisture
    • Does not require mixing
    • Designed for aerospace applications
    • Provides high elongation
    • Good physical and electrical stability
    • Complies with NASA low outgassing requirements
    • Protects components from extreme temperatures, high humidity, thermal shock, radiation, atomic oxygen, and mechanical vibration
  • DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
    Read more Quick View

    DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
    • Two-part silicone elastomer encapsulant
    • Low thermal vacuum outgassing
    • Physical and electrical stability
    • Wide operating temperature range.
    • Certified to NASA requirements for extreme environment applications.
  • DOWSIL™ CC-3122 Conformal Coating
    Read more Quick View

    DOWSIL™ CC-3122 Conformal Coating
    • One-component silicone conformal coating
    • Translucent
    • Low viscosity
    • Moisture cure (RTV)
    • Solvent-free
    • Provides environmental resistance
    • Dielectric protection
    • Long-term reliability even in harsh environmental conditions
    • UL recognized and includes a UV indicator for coating inspection.
  • DOWSIL™ EA-6060 Adhesive
    Read more Quick View

    DOWSIL™ EA-6060 Adhesive
    • Two-part silicone adhesive
    • Non-sag
    • Fast low-temperature cure
    • Accelerated cure at moderate temperature (80 °C)
    • Rapid adhesion development.
    • The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
    • Maintains physical and electrical properties across a wide range of operating conditions.
    • Primerless adhesion
  • DOWSIL™ EG-1200 Gel
    Read more Quick View

    DOWSIL™ EG-1200 Gel
    • Gel is a two-component addition-cure silicone gel
    • Clear and flowable,
    • Designed for optically clear potting and coupling applications in displays and LED lighting systems.
    • High transparency
    • Reduced yellowing
    • High surface adhesion
    • Good stress absorption capacity
    • Provides mechanical protection, electrical insulation and long-term reliability.
    • Can cure at room temperature or with thermal acceleration.
  • DOWSIL™ TC-2035 Thermally Conductive Adhesive
    Read more Quick View

    DOWSIL™ TC-2035 Thermally Conductive Adhesive
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance