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DOWSIL™ TC-2035 Thermally Conductive Adhesive

  • Mixing ratio mixture 1:1
  • Thermally conductive silicone
  • Platinum curing system
  • Polymerization at room temperature
  • Provides long-term stability
  • Polymerizes without exothermia
  • Thixotropic, non-sagging
  • Resistant to ozone and ultraviolet degradation
  • Provides high cooling performance