Mil-I-46058C

    • Medium viscosity
    • Low VOC content
    • Abrasion resistance
    • Good dielectric properties
    • Good adhesion to many substrates
    • Polymerization at room temperature
    • Stable and flexible over a wide temperature range
    • Single-component, does not require mixing
    • Good fluidity
    • After dispensing, it is capable of flowing, filling or self-leveling
    • Faster inline machining with optional thermal acceleration
    • No solvent added
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
    • UV indicator enables automatic inspection
    • No solvent added
    • Polymerization at room temperature
    • Slight thermal acceleration can speed up in-line processing
    • Good adhesion to many substrates
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses