Mil-I-46058C

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    • Medium viscosity
    • Low VOC content
    • Abrasion resistance
    • Good dielectric properties
    • Good adhesion to many substrates
    • Polymerization at room temperature
    • Stable and flexible over a wide temperature range
    • Single-component silicone conformal coating
    • Transparent
    • Thermal polymerization
    • Designed for the protection of rigid and flexible printed circuit boards.
    • Low viscosity
    • Without added solvents
    • Cures into a soft, low-stress elastomer, reducing stress on electronic components.
    • Incorporates a UV indicator to facilitate automated inspection
    • UL, IPC and MIL certified.
    • Single-component, does not require mixing
    • Good fluidity
    • After dispensing, it is capable of flowing, filling or self-leveling
    • Faster inline machining with optional thermal acceleration
    • No solvent added
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
    • UV indicator enables automatic inspection
    • No solvent added
    • Polymerization at room temperature
    • Slight thermal acceleration can speed up in-line processing
    • Good adhesion to many substrates
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
    • Two-part silicone adhesive
    • Non-sag
    • Fast low-temperature cure
    • Accelerated cure at moderate temperature (80 °C)
    • Rapid adhesion development.
    • The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
    • Maintains physical and electrical properties across a wide range of operating conditions.
    • Primerless adhesion