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Showing 41–60 of 120 results

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • No solvent added
    • Polymerization at room temperature
    • It can speed up in-line processing
    • Good adhesion to many substrates
    • Allows use with many low-solids lead-free solder
    • Improves reliability against stresses
    • Promotes flow and filling of narrow spaces and crevices
    • UV curing in 1 part
    • Very soft
    • Suitable for very low temperatures
    • Does not require mixing
    • UV rays for fast processing speed
    • Polymerization secondary to moisture
    • The gel remains flexible even at very low temperatures
    • Medium hardness (Shore 00)
    • Promotes application on sloping surfaces
    • Easy to use
    • Mixing ratio
    • Rapid polymerization at room temperature
    • It does not require temporary storage of the
    • equipped parts
    • Low compression set maintained at high service temperatures
    • Stable and flexible over a wide range of temperatures
    • Medium hardness (Shore 00)
    • Reduced flow favors application on sloping surfaces
    • Easy to use, handy 1:1 mixing ratio
    • Rapid curing at room temperature, with no need for temporary storage of the equipped parts
    • Low compression set that is maintained at high service temperatures service temperatures
    • Stable and flexible over a wide range of temperatures
    • Single-component
    • Does not require mixing
    • Good fluidity
    • Capable of flowing, filling or self-leveling
    • Polymerization at room temperature
    • No solvent added
    • UV indicator for manual and automatic inspections
    • Mellow
    • High tensile strength and elongation resistance
    • High thermal stability
    • Single component - Does not require mixing
    • Polymerization at room temperature
    • One-part dielectric gel
    • Transparent
    • Hot polymerization
    • Low viscosity
    • Very soft gel
    • Suitable for PCB potting and electronic component protection
    • Electrical insulation and environmental protection
    • Extended temperature range (-60°C / +200°C)
    • No mixing required
    • Not smooth
    • Low levels of volatile condensable materials
    • High elongation for greater stress reduction
    • No mixing required
    • Faster inline machining with optional thermal acceleration
    • Proven for space applications
    • Improves the inhibition resistance of addition-cured silicones
    • Diluted in heptane
    • Most metals, glass and ceramics
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition
    • Two-component 1:1 optical silicone
    • Molding resin for optical applications
    • High light transmittance
    • Low chromatic dispersion
    • UV and heat resistant
    • High surface detail replication
    • High Shore A
    • Fast heat curing
    • One-component clear primer
    • Dispersed in naphtha
    • Improves adhesion of RTV and thermosetting silicones to many substrates
    • Can be used on most substrates
    • Improves the adhesion of RTV and thermosetting silicones
    • Improves the adhesion of many wet-cure RTV silicones
    • Rapid polymerization
    • Suitable for very low temperatures
    • Rapid thermal polymerization to speed up processing
    • Gel remains flexible in ultra-low temperature applications
    • Cleaning solvent
    • Contains a special catalyst for adhesion preparation
    • Easy to apply
    • Ready to use
    • Cleaning and surface preparation in one step
    • Increased security
    • Rapid polymerization in RT, without notches
    • Medium viscosity
    • Polymerizes into a soft, low-stress elastomer
    • Without added solvents
    • Slight thermal acceleration can speed up in-line processing
    • Soft coating can improve reliability against stresses
    • Rapid polymerization in RT
    • Mellow
    • High elongation
    • Controlled volatility of silicone
    • Single-component - No mixing required
    • Transparent coating with excellent clarity
    • UV resistant
    • Ideal for LED applications
    • Reduces operational risks
    • Free of aromatic solvents such as toluene and xylene
    • Efficient application of coating at room temperature
    • Ideal for applications requiring rework
    • Can be removed with ULS
    • Provides excellent adhesion to all substrates
    • Good temperature range and dielectric properties
    • Can be welded through the UV track for easy inspection
    • Can be removed with solvents such as Ultrasolve (ULS)
    • Cheap
    • Enables efficient application
    • Fast drying time