5 / <0
Showing all 10 results
Filtri

Tipo di prodotto
- 10 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
-
- Good resistance to temperature shock
- Flexible jets
- Low viscosity
-
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
-
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
-
- Two-component resin for high temperature
- It cross-links at room temperature but can be accelerated with heat
- Halogen-free system
-
- Polymerization at room temperature or moderate heat
- Easy castability and impregnation
- Mixing ratio 100:23 by weight
- Excellent electrical properties
- Absorbs sudden thermal shock
- Suitable for a low-stress encapsulant
- Halogen free
-
- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
-
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
-
- Soft, reworkable resin
- It can be "dug out"
- Flexible even in extreme temperatures
- Ideal for prototype circuits
- Replacement of silicone and control unit
-
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
-
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity







