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Resins and encapsulants
Resins and encapsulants
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Epoxy (2)
Polyurethane (4)
Silicone (4)
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Adapters (1)
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Araldite® CW 2245
Good resistance to temperature shock
Flexible jets
Low viscosity
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Araldite® XB 2252-1 / XB 2253-1
Good resistance to thermal shock
Good dielectric properties
Good mechanical properties
Excellent thermal resistance
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Arathane® CW 5620
Good thermal resistance
Excellent sliding properties
Good thermal conductivity
Non-abrasive casting system
Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
Two-component resin for high temperature
It cross-links at room temperature but can be accelerated with heat
Halogen-free system
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Arathane® Vb U 6912 P Polyol / Vb U001/B Isocian
Polymerization at room temperature or moderate heat
Easy castability and impregnation
Mixing ratio 100:23 by weight
Excellent electrical properties
Absorbs sudden thermal shock
Suitable for a low-stress encapsulant
Halogen free
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
Low viscosity
Good thermal conductivity
Mixing ratio 1 to 1
Polymerization at room temperature
Easy to mix and use
Good smoothness for fast processing and short cycle times
Promotes heat dissipation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Reduces pressure on components
Effectively dissipates heat
Avoids delamination problems
The rapid polymerization
Optimized processing time
Allows for the implementation of complex projects
No additional dielectric barrier required
Allows for quick filling
It is suitable for high-throughput production processes.
Filling allows easy control of the process
Meets certification requirements
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Electrolube UR5044 Polyurethane Resin
Soft, reworkable resin
It can be "dug out"
Flexible even in extreme temperatures
Ideal for prototype circuits
Replacement of silicone and control unit
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SYLGARD™ 160 Silicone Elastomer Kit
Gray fluid encapsulant
Room temperature or hot curing
Fast and versatile curing process
Good dielectric properties
Moderate thermal conductivity
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SYLGARD™ 164 Silicone Elastomer Kit
Fast and versatile polymerization, controlled by temperature
Good dielectric properties
Moderate thermal conductivity
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