Shore A (elastomeric)

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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ARALDITE® 1570 FST A/B
- Two-component epoxy adhesive
- Halogen-free
- Compliant with FST (Flame, Smoke, Toxicity) requirements
- Self-extinguishing
- Thixotropic paste formulation
- Room temperature curing
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ARALDITE® 1641 A/B
- Ultra-low density syntactic epoxy adhesive
- Easily pumpable
- Non-sag after application
- Good resistance to vibrational fatigue
- Designed to reduce cracking tendency in high-stress applications
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ARALDITE® 1644 A/B
- Ultra-low density syntactic epoxy adhesive
- Non-sag
- Designed for edge sealing and void filling
- High compressive strength-to-density ratio
- Manual or extrusion application
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ARALDITE® 40002/40003
- Two-component epoxy system
- FST Properties (Fire, Smoke, Toxicity)
- Intrinsically flame retardant
- Low viscosity for infusion and RTM processes
- Heat curing
- High mechanical performance
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ARALDITE® 501 A/B
- Two-component epoxy adhesive
- Low-viscosity system
- Good substrate wetting
- Room temperature curing
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ARALDITE® LY 1564 SP / ARADUR® 2954
- Two-component epoxy system for composites
- Amine system without reactive diluents
- High flexibility and high reactivity
- Suitable for hot processes
- Good reinforcement impregnation
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ARALDITE® LY 3508 / ARADUR® 22962
- Toughened two-component epoxy system
- Medium resin viscosity
- Good toughness combined with low viscosity
- Suitable for lamination and molding processes
- Heat curing
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ARALDITE® LY 3508 / ARADUR® 3475
- Two-component epoxy system
- Medium-viscosity toughened resin
- Good toughness and mechanical strength
- Suitable for lamination and molding processes
- Heat curing
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ARALDITE® LY 8615 / ARADUR® 8615
- Two-component high-temperature epoxy system
- Low viscosity for RTM, SCRIMP, and VARTM processes
- Long pot life
- High glass transition temperature (Tg > 180 °C with post-cure)
- Suitable for the production of composite parts and molds
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CG 1305 A/B
- Two-component syntactic epoxy system
- Medium density and low specific weight
- High mechanical strength
- Pourable
- Designed for honeycomb structure reinforcement and potting
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DOWSIL™ 1-4105 Conformal Coating
- Single-component silicone conformal coating
- Transparent
- Thermal polymerization
- Designed for the protection of rigid and flexible printed circuit boards.
- Low viscosity
- Without added solvents
- Cures into a soft, low-stress elastomer, reducing stress on electronic components.
- Incorporates a UV indicator to facilitate automated inspection
- UL, IPC and MIL certified.
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DOWSIL™ 3-6548 Silicone RTV Foam
- Two-component fire-resistant RTV silicone foam
- Two-component room temperature vulcanizing (RTV) silicone foam
- Fire resistant
- Good flexibility even under severe operating conditions
- Withstand high temperatures
- Designed to limit hazards such as smoke, flames and gases.
- Expands and cures at room temperature to form a closed-cell foam elastomer.
- Designed for creating fire-resistant seals in penetrations and linear joints.
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DOWSIL™ CC-3122 Conformal Coating
- One-component silicone conformal coating
- Translucent
- Low viscosity
- Moisture cure (RTV)
- Solvent-free
- Provides environmental resistance
- Dielectric protection
- Long-term reliability even in harsh environmental conditions
- UL recognized and includes a UV indicator for coating inspection.
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DOWSIL™ EG-1200 Gel
- Gel is a two-component addition-cure silicone gel
- Clear and flowable,
- Designed for optically clear potting and coupling applications in displays and LED lighting systems.
- High transparency
- Reduced yellowing
- High surface adhesion
- Good stress absorption capacity
- Provides mechanical protection, electrical insulation and long-term reliability.
- Can cure at room temperature or with thermal acceleration.
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EPIBOND® 115 A/B
- High-temperature structural epoxy adhesive
- Two-component epoxy adhesive
- Service up to 149°C (300°F)
- High shear strength on metals and composites
- Thixotropic gap-filling paste
- Contains 125-micron spacer beads
- High Tg
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EPIBOND® 200 A/B
- Flexible epoxy structural adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Good performance retention after environmental aging
- 1:1 mixing ratio by weight and volume
- SVHC-free according to REACH
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EPIBOND® 215 A/B
- High-strength structural epoxy adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Fast handling strength
- Good performance retention after environmental aging and chemical immersion
- SVHC-free according to REACH
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EPIBOND® 315 A/B
- Two-component epoxy adhesive
- Pasty consistency
- High mechanical strength
- Good adhesion to metals
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EPIBOND® 420 A/B
- Structural applications
- Room temperature curing paste
- High toughness and resilience
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EPIBOND® 8000 FR A/B
- Structural epoxy adhesive, flame retardant
- Self-extinguishing properties according to FAR 25.853
- High shear and peel strength
- Thixotropic gap-filling paste
- Curable from room temperature to elevated temperatures
- Free of halogenated additives and antimony
- No SVHC according to REACH