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Monocomponent at room temperature

Showing 21–40 of 54 results

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1 Anaerobic activator Anaerobic activator
9 Anaerobic adhesive Anaerobic adhesive
36 Elastomeric adhesive Elastomeric adhesive
1 Instant adhesive Instant adhesive

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Born2Bond™ Retaining RA-48
- High strength
- Medium viscosity
- High power transmission
- Resistance to dynamic loads
- Recommended for gaps up to 0.15 mm Vibration resistant
- Corrosion prevention
- Single component
- Suitable for active and passive metals
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Born2Bond™ Retaining RA-60
- High strength
- High viscosity / Paste
- High gap filling (up to 0.5 mm)
- High power transmission
- Resistance to dynamic loads
- Vibration resistance
- Corrosion prevention
- Single component
- Suitable for active and passive metals
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Born2Bond™ Structural (Copia)
- Grip time 30 seconds
- High adhesion strength: > 6 MPa after 5 min
- Open time 25 minutes
- Filling gaps between substrates up to 5 mm
- Excellent adhesion to a wide variety of substrates
- Translucent when cross-linked
- Resistant to temperature and humidity
- Gel consistency for precise dosing
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Born2Bond™ Structural (Copia) (Copia)
- Grip time 30 seconds
- High adhesion strength: > 6 MPa after 5 min
- Open time 25 minutes
- Filling gaps between substrates up to 5 mm
- Excellent adhesion to a wide variety of substrates
- Translucent when cross-linked
- Resistant to temperature and humidity
- Gel consistency for precise dosing
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Born2Bond™ Structural (Copia) (Copia) (Copia)
- Grip time 30 seconds
- High adhesion strength: > 6 MPa after 5 min
- Open time 25 minutes
- Filling gaps between substrates up to 5 mm
- Excellent adhesion to a wide variety of substrates
- Translucent when cross-linked
- Resistant to temperature and humidity
- Gel consistency for precise dosing
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Born2Bond™ Structural (Copia) (Copia) (Copia) (Copia)
- Grip time 30 seconds
- High adhesion strength: > 6 MPa after 5 min
- Open time 25 minutes
- Filling gaps between substrates up to 5 mm
- Excellent adhesion to a wide variety of substrates
- Translucent when cross-linked
- Resistant to temperature and humidity
- Gel consistency for precise dosing
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Born2Bond™ Structural (Copia) (Copia) (Copia) (Copia) (Copia)
- Grip time 30 seconds
- High adhesion strength: > 6 MPa after 5 min
- Open time 25 minutes
- Filling gaps between substrates up to 5 mm
- Excellent adhesion to a wide variety of substrates
- Translucent when cross-linked
- Resistant to temperature and humidity
- Gel consistency for precise dosing
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Born2Bond™ Ultra MV
- High adhesion strength
- Long time open
- Low blooming
- Less brittle than conventional instant adhesives
- They glue a wide range of materials, including polystyrene
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DOWSIL™ 3525 Adhesive Sealant
- Adhesion to metals and plastics
- Weathering resistance
- UV resistance
- Non-corrosive
- Neutral polymerization
- Not oily
- Ready to use
- Short time of no adherence
- Solvent-free: low shrinkage
- Good mechanical properties: high
- Tear resistance
- Elongation resistance
- Tensile strength
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DOWSIL™ 6-1104 Controlled Volatility Sealant
- Not smooth
- Low levels of volatile condensable materials
- High elongation for greater stress reduction
- No mixing required
- Faster inline machining with optional thermal acceleration
- Proven for space applications
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DOWSIL™ 7091 Adhesive Sealant
- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Excellent adhesion to many substrates
- Stable and flexible from -40°C (-40°F) to 180°C (356°F)
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DOWSIL™ 7092 High Green Strength Adhesive and Sealant
- Provides instant green force
- Easy-to-use one-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Pasty and non-sticky consistency
- Cures into a durable and flexible rubber
- Stable and flexible from -50°C to +150°C
- UL 94 HB
- Rapid resistance formation promotes increased productivity due to rapid handling of bonded units
- Saves time because no buffer is needed for increasing resistance
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DOWSIL™ 7093 Adhesive Sealant
- One-component adhesive sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy polymerization system
- Pasty consistency, does not bag
- Easy to apply
- Low modulus for high movement capacity
- Good adhesion on many substrates
- Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
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DOWSIL™ 7094 Flowable Sealant
- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Fluid and self-leveling
- Easy to apply
- Excellent primerless adhesion to many substrates
- Stable and flexible from -50°C to +180°C
- Non-corrosive to metals
- Low odor
- Primerless adhesion to mixed substrates
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DOWSIL™ 730 FS Solvent Resistant Sealant
- One-component fluorosilicone sealant adhesive.
- It cures at room temperature when
- exposed to moisture in the air
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -65°C (-85°F) to 260°C (500°F)
- Retains its properties when exposed to fuels, oils and solvents
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DOWSIL™ 732 Multi-Purpose Sealant
- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -60°C to +180°C (-76°F to +356°F), with short peaks up to +205°C (401°F)
- Black version: stable and flexible from -60°C to +205°C (-76°F to +401°F), with short peaks up to +230°C (446°F)
- Excellent dielectric properties
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DOWSIL™ 734 Flowable Sealant
- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Fluid and self-leveling
- Easy to apply
- Cures into a durable and flexible rubber
- Rapid no-grip time
- Good adhesion to many substrates
- Stable and flexible from -65°C (-85°F) to +180°C (+356°F)
- Excellent dielectric properties
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DOWSIL™ 736 Heat Resistant Sealant
- It does not sag and drip
- Can be applied overhead or on side walls
- Can be used in applications with continuous exposure at 260°C (500°F) and intermittent exposure at 315°C (600°F)
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DOWSIL™ 738 Electrical Sealant
- Not smooth
- Polymerization at room temperature
- High elongation for greater stress reduction
- No mixing required
- Polymerization at room temperature, no need for ovens
- Faster inline machining with optional thermal acceleration
- Improved reliability through reduced curing stresses
- Automated or manual needle dispensing systems
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DOWSIL™ 748 Non-Corrosive Sealant
- Can be used in corrosion-sensitive electrical equipment and PCB systems without adverse effects
- Easy to handle
- UL Classified
- Non-corrosive
- Low odor
- Cures at room temperature

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