DOWSIL™ Q3-1566 Heat Resistant Adhesive/ Sealant

  • Cures at room temperature when exposed to air humidity
  • Acetoxy polymerization system
  • Pasty and non-sagging consistency
  • Easy to apply
  • Good adhesion on many substrates

Additional information

Product Type
Brand
Technology
Chemistry
Mecc. polymerization
Tasso di estrusione (g/min)
Color
Temp. min
Temp. max
Substrati , ,
Tempo pelle
Shore hardness
Elong. at break