Cold
Showing 1–20 of 79 results
Filtri
The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
-
- Two-component epoxy adhesive
- Halogen-free
- Compliant with FST (Flame, Smoke, Toxicity) requirements
- Self-extinguishing
- Thixotropic paste formulation
- Room temperature curing
-
- Ultra-low density syntactic epoxy adhesive
- Easily pumpable
- Non-sag after application
- Good resistance to vibrational fatigue
- Designed to reduce cracking tendency in high-stress applications
-
- Ultra-low density syntactic epoxy adhesive
- Non-sag
- Designed for edge sealing and void filling
- High compressive strength-to-density ratio
- Manual or extrusion application
-
- Two-component epoxy system
- FST Properties (Fire, Smoke, Toxicity)
- Intrinsically flame retardant
- Low viscosity for infusion and RTM processes
- Heat curing
- High mechanical performance
-
- Two-component epoxy adhesive
- Low-viscosity system
- Good substrate wetting
- Room temperature curing
-
- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
-
- Good resistance to temperature shock
- Flexible jets
- Low viscosity
-
- Low viscosity casting resin
- High possibility of adding filler
- Encapsulation of electronic and low-voltage components
-
- Two-component epoxy system for composites
- Amine system without reactive diluents
- High flexibility and high reactivity
- Suitable for hot processes
- Good reinforcement impregnation
-
- Toughened two-component epoxy system
- Medium resin viscosity
- Good toughness combined with low viscosity
- Suitable for lamination and molding processes
- Heat curing
-
- Two-component epoxy system
- Medium-viscosity toughened resin
- Good toughness and mechanical strength
- Suitable for lamination and molding processes
- Heat curing
-
- Two-component low-viscosity epoxy system
- Long pot life
- Good reinforcement impregnation
- Room temperature curing with post-cure capability
-
- Two-component high-temperature epoxy system
- Low viscosity for RTM, SCRIMP, and VARTM processes
- Long pot life
- High glass transition temperature (Tg > 180 °C with post-cure)
- Suitable for the production of composite parts and molds
-
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
-
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
-
- Two-component resin for high temperature
- It cross-links at room temperature but can be accelerated with heat
- Halogen-free system
-
- Two-component syntactic epoxy system
- Medium density and low specific weight
- High mechanical strength
- Pourable
- Designed for honeycomb structure reinforcement and potting
-
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- The optional thermal acceleration (after solvent wilting)
- UV indicator enables automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emission recovery can be simplified for VOCs in some U.S. states
-
- Cures to a robust surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- Possibility of acceleration after solvent spillage
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low viscosity improves flow and
- fill tight spaces and gaps
-
- Green when mixed
- Rapid polymerization at room temperature
- Reduces the risk of loading errors
