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Showing 61–79 of 79 results

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Two-component structural epoxy adhesive
    • Low-density syntactic formulation
    • Non-sag after application
    • Suitable for structural reinforcement applications
    • Sandable after complete polymerization
    • Two-component structural epoxy adhesive
    • Low-density syntactic formulation
    • Non-sag after application
    • Suitable for structural reinforcement operations
    • Sandable after curing
    • Low density syntactic epoxy adhesive
    • Dense paste consistency
    • High compressive strength
    • Good high temperature performance after room temperature cure
    • Suitable for core filling, stiffness enhancement and structural reinforcement
    • Two-component laminating epoxy system
    • Solvent-free epoxy system
    • High temperature performance (up to 149°C)
    • Medium viscosity
    • Long work life
    • Suitable for repairs and fabrication of laminated structures
    • Unfilled two-component epoxy system
    • Solvent-free
    • Easy to process
    • High mechanical strength
    • Flame retardant
    • Long pot life
    • Two-component epoxy system for structural repairs
    • Designed for aerospace composite repairs
    • Good hot/wet resistance
    • Resistant to fuels, hydraulic fluids, oils, and moisture
    • Supplied in pre-measured resin + hardener kits
    • Two-component epoxy system
    • Unfilled and solvent-free
    • High mechanical strength
    • Self-extinguishing
    • Short pot life
    • Unfilled two-component epoxy system
    • Solvent-free
    • Easy to process
    • High mechanical strength
    • Flame retardant
    • Long pot life
    • Structural syntactic epoxy adhesive
    • One-component (supplied frozen)
    • Flame retardant and self-extinguishing
    • High compressive strength
    • Thixotropic paste after thawing
    • Extrudable with pneumatic equipment
    • Designed for honeycomb structure reinforcement
    • Provides >52 dB RFI shielding at frequencies <1 MHz
    • Excellent adhesion to plastics
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene or xylene
    • UL Recognized (File No. E202609)
    • Provides effective EMI/RFI shielding over a wide range of frequencies
    • Strong corrosion resistance
    • Gentle and safe solvent system on polystyrenes
    • HAP free-does not contain toluene, xylene, or MEK
    • Available in aerosol format
    • Provides superior EMI shielding
    • Excellent adhesion to plastics
    • Minimum height of thin layer
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene, xylene or MEK
    • RTV silicone rubber for moulds, encapsulation and potting
    • High mechanical strength
    • High Shore hardness
    • Very low shrinkage and good dimensional stability
    • Good tear propagation resistance
    • Suitable for high-temperature casting
    • Room temperature curing within 24 hours
    • Heat-accelerated curing
    • Long mold life
    • Highly detailed reproduction
    • Simplified handling
    • RTV silicone rubber for molds, encapsulation and potting
    • High mechanical strength
    • High Shore hardness
    • Very low shrinkage and good dimensional stability
    • Good tear propagation resistance
    • Suitable for high-temperature casting
    • Room temperature curing within 24 hours
    • Heat-accelerated curing
    • Long mold life
    • Highly detailed reproduction
    • Simplified handling
    • Two-component addition-cure RTV silicone
    • High mechanical strength
    • High tear resistance
    • High elongation
    • Minimal shrinkage (0–0.1%)
    • Long pot life
    • Cures at room temperature in 24 hours
    • Heat-accelerated cure
    • Acceptable for food contact
    • Seals and protects PCBs and electronic devices
    • Used for delicate electrical devices
    • Offers excellent flexibility
    • Cures even at room temperature
    • Isolate circuits from harmful effects
    • Special class of encapsulants
    • Polymerizes into an extremely soft material
    • Protects circuits and interconnections
    • Operational over a wide temperature range
    • Two-component polyurethane system
    • Suitable for industrial applications
    • Liquid formulation
    • Two-component polyurethane system
    • Elastic structural adhesive
    • Good adhesion on various substrates
    • Two-component polyurethane system
    • Non-sag paste consistency
    • Can be used as adhesive, sealant or caulking compound
    • Mixing ratio 1:1 by volume
    • Good environmental stability to UV and humidity