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Showing 21–39 of 39 results

    • One-component epoxy encapsulant
    • Semi-thixotropic
    • Effective polymerization quickly
    • High ionic purity
    • Low ionizable chlorine content
    • Long processing time
    • Resistant to fuels and solvents
    • Offers processing flexibility
    • Used where resistance to fuels or solvents is required
    • Thermal conductivity of 1.4 W/(m-K)
    • Mixing ratio 1:1
    • Processing time: 45 minutes
    • Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
    • Provides strong electrical insulation
    • High mechanical strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Thermal conductivity of 0.8 W/(m-K)
    • Mixing ratio 1:1
    • Fire retardant - UL 94V-0 registered
    • Processing time: 5 minutes
    • Laying time: 15 minutes
    • Provides strong electrical insulation
    • Low CTE before Tg
    • High tensile and compressive strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substratesStorage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Low outgassing approved by NASA
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Low outgassing approved by NASA
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Good conductivity
    • Provides good RFI shielding
    • Extreme durability and grip
    • Strong resistance to solvents
    • Excellent corrosion and salt spray resistance
    • Provides effective EMF shielding
    • Ideal for wood and drywall
    • Ideal for shielding the cavities of electric guitars
    • Non-flammable and without harmful odors
    • Low VOC content
    • Upper EMI shielding
    • Polymerization at room temperature and high
    • Excellent chemical and corrosion resistance
    • Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
    • Resists wave soldering
    • Without MEK and HAPS
    • Provides excellent EMI/RFI shielding over a wide frequency range
    • Non-flammable and without harmful odors
    • Shipping as non-DG by air
    • Low VOC content
    • Provides excellent electromagnetic shielding
    • Ideal for wood and drywall
    • Ideal for musical instruments
    • Non-flammable and without harmful odors
    • Low VOC content
    • High electrical conductivity
    • Creates strong permanent electrical connections
    • No mixing is required
    • Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
    • Storage at room temperature (≤ 22 °C)
    • Suitable for automated distribution
    • High thermal conductivity
    • No mixing is required before use
    • Provides strong electrical insulation
    • Low curing temperature (<100 °C)
    • Storage at room temperature (≤ 22 °C)
    • Binds well to a wide variety of substances
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Two-component Fluoro Liquid Silicone Rubber (F-LSR) for liquid injection molding
    • High resistance to fuels, oils and solvents
    • Chemical and fluid resistance
    • Fast-curing platinum technology, without by-products
    • Curing over a wide temperature range
    • High resistance to high temperatures
    • Fast and versatile polymerization, controlled by temperature
    • Good dielectric properties
    • Moderate thermal conductivity
    • General use
    • Low viscosity
    • Addition curing system
    • No polymerization by-products
    • Self-healing gel
    • Permanent pressure-sensitive adhesion
    • Excellent dielectric properties
    • Long-term sealing against atmospheric contaminants
    • Heat-conductive encapsulant
    • 2 parts
    • Fluid, self-leveling
    • Long processing time at room temperature
    • Temperature-controlled polymerization
    • Increases reliability