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Araldite® CY 221 / Aradur® HY 2966
- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
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Arathane® Vb U 6912 P Polyol / Vb U001/B Isocian
- Polymerization at room temperature or moderate heat
- Easy castability and impregnation
- Mixing ratio 100:23 by weight
- Excellent electrical properties
- Absorbs sudden thermal shock
- Suitable for a low-stress encapsulant
- Halogen free
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DOWSIL™ 1-4105 Conformal Coating
- Single-component silicone conformal coating
- Transparent
- Thermal polymerization
- Designed for the protection of rigid and flexible printed circuit boards.
- Low viscosity
- Without added solvents
- Cures into a soft, low-stress elastomer, reducing stress on electronic components.
- Incorporates a UV indicator to facilitate automated inspection
- UL, IPC and MIL certified.
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DOWSIL™ 3-1944 RTV Coating
- Single-component, does not require mixing
- Good fluidity
- After dispensing, it is capable of flowing, filling or self-leveling
- Faster inline machining with optional thermal acceleration
- No solvent added
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
- UV indicator enables automatic inspection
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DOWSIL™ 3-4241 Dielectric Tough Gel Kit
- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Good mechanical strength
- Contains UV indicator for inspection
- Adhesion without the use of primer
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ 3810 EG
- One-part dielectric gel
- Transparent
- Hot polymerization
- Low viscosity
- Very soft gel
- Suitable for PCB potting and electronic component protection
- Electrical insulation and environmental protection
- Extended temperature range (-60°C / +200°C)
- No mixing required
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DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
- Two-part silicone elastomer encapsulant
- Low thermal vacuum outgassing
- Physical and electrical stability
- Wide operating temperature range.
- Certified to NASA requirements for extreme environment applications.
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DOWSIL™ EA-6060 Adhesive
- Two-part silicone adhesive
- Non-sag
- Fast low-temperature cure
- Accelerated cure at moderate temperature (80 °C)
- Rapid adhesion development.
- The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
- Maintains physical and electrical properties across a wide range of operating conditions.
- Primerless adhesion
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DOWSIL™ EC-8425
- High electrical conductivity (silver-based filler)
- Electromagnetic shielding (EMC) over a wide frequency range
- High elongation for stress relief (>20%)
- Non-slump adhesive (non-flowable)
- UV traceability for inspection
- Good adhesion on various substrates
- Solvent-free formulation
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DOWSIL™ MS-1002 Moldable Silicone
- Two-component 1:1 optical silicone
- Molding resin for optical applications
- High light transmittance
- Low chromatic dispersion
- UV and heat resistant
- High surface detail replication
- High Shore A
- Fast heat curing
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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DOWSIL™ SC 102 Compound
- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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DOWSIL™ TC-2035 Thermally Conductive Adhesive
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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DOWSIL™ TC-4515 Gap Filler A&B
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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Electrolube APL Acrylic Protective Lacquer
- Provides excellent adhesion to all substrates
- Good temperature range and dielectric properties
- Can be welded through the UV track for easy inspection
- Can be removed with solvents such as Ultrasolve (ULS)
- Cheap
- Enables efficient application
- Fast drying time
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Electrolube DCA Spray
- Alkyd conformal coating
- Low VOC
- Specific for the protection of electronic circuits
- Suitable for use in extreme temperatures
- Better performance at high temperatures
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Electrolube DCB SCC3 Black Conformal Coating
- Allows the PCB design to be camouflaged
- High resistance to chemicals and solvents
- Extremely wide operating temperature range
- Resistant to solvents from the automotive and aerospace industries
- The hardened coating can be removed with Electrolube
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Electrolube DCR SCC3
- Minimizes circuit board design
- High resistance to chemicals and solvents
- Extremely wide operating temperature range
- Resistant to solvents in aerospace and automotive industries