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- 1 Anaerobic activator
- 9 Anaerobic adhesive
- 23 Anti friction coating
- 8 Cleaner
- 2 Cleaners
- 5 Compound
- 1 Conductive paints
- 19 Conformal coating
- 7 Dispersions
- 49 Elastomeric adhesive
- 5 Electrically conductive adhesives
- 16 Electronics adhesive
- 2 Gap filler
- 8 Gel
- 93 Greases
- 10 Heat-conductive adhesive
- 3 Hot-Melt Stickers
- 7 Instant adhesive
- 72 Oils
- 20 Pastes
- 13 Primer
- 31 Resins and encapsulants
- 3 Solid lubricant
- 2 special
- 40 Structural adhesive
- 6 Thermal conductive paste
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Tecnologia
Applicazioni
The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
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- Fast and homogeneous deep polymerization
- Early adhesion at room temperature
- Pasty, non-self-levelling consistency
- Rapid handling of bonded components
- Fast assembly process
- Durable adhesion to a wide variety of substrates
- Excellent resistance to weathering and U.V. rays.
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No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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- Meets BS 476 Part 22 standard
- Excellent primerless adhesion on most substrates
- porous and non-porous buildings
- It does not drip
- Joint movement capacity ±50%
- Neutral curing system
- Halogen-free
- Complies with ISO 11600-F&G-25LM Standard
- A fire resistance value of up to 4 hours can be obtained
- Extensively tested on many European specifications
- Out of footprint in 1.5 hours
- Excellent weathering characteristics, including resistance to ozone, UV radiation and extreme temperatures
- Long service life
- CE marked as fire resistant according to ETAG 026
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- One-component clear primer
- Dispersed in naphtha
- Improves adhesion of RTV and thermosetting silicones to many substrates
- Can be used on most substrates
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- Improves the adhesion of RTV and thermosetting silicones
- Improves the adhesion of many wet-cure RTV silicones
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- Improves the adhesion of RTV and thermoset silicones to substrates
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- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Good adhesion on many substrates
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- Rapid handling of bonded components: rapidly develops adhesive strength at room temperature, enabling rapid handling of components.
- Adheres to suitably prepared polypropylene.
- Two-component system with 10:1 mixture ratio by weight. Non-corrosive and low-odor curing.
- It contains no solvents.
- The non-lumpy nature of the mixture allows the extruded bead to remain in place without flowing.
- Excellent resistance to weathering, UV rays and heat up to 190°C.
- Available in two color versions: Gray (RAL 7038) and Black (RAL 7016).
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- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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- Superior sealing characteristics when exposed to fuels and oils
- Easily injected and reinjected
- Does not harden
- Good grip
- Essentially unaffected by shock, vibration, and thermal cycling
- Contains no hardeners or curing agents
- Withstands immersion in fuels and exposure to fuel vapors at temperatures up to +200°C
- Contains flow control particles
- Excellent flow characteristics allow faster injection at lower pressures.
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- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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- Cleaning solvent
- Contains a special catalyst for adhesion preparation
- Easy to apply
- Ready to use
- Cleaning and surface preparation in one step
- Increased security
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- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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- Mellow
- Two-component - 10:1 mixing ratio
- High tensile strength
- Good processing time after mixing
- Hot polymerization
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- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
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- Rapid polymerization in RT, without notches
- Medium viscosity
- Polymerizes into a soft, low-stress elastomer
- Without added solvents
- Slight thermal acceleration can speed up in-line processing
- Soft coating can improve reliability against stresses
