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Dowsil

Showing 1–20 of 76 results

Product type

10 Conformal coating Conformal coating
26 Elastomeric adhesive Elastomeric adhesive
16 Electronics adhesive Electronics adhesive
2 Gap filler Gap filler
6 Gel Gel
10 Heat-conductive adhesive Heat-conductive adhesive
4 Resins and encapsulants Resins and encapsulants
1 Thermal conductive paste Thermal conductive paste

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DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Single-component solvent-based resin coating
- Polymerization at room temperature
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2577 Low VOC Conformal Coating
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- The optional thermal acceleration (after solvent wilting)
- UV indicator enables automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emission recovery can be simplified for VOCs in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to a robust surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- Possibility of acceleration after solvent spillage
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low viscosity improves flow and
- fill tight spaces and gaps
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DOWSIL™ 1-2620 Low VOC Conformal Coating
- Medium viscosity
- Low VOC content
- Abrasion resistance
- Good dielectric properties
- Good adhesion to many substrates
- Polymerization at room temperature
- Stable and flexible over a wide temperature range
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Hot polymerization
- Good thermal conductivity values
- No solvent added
- Single-component - No need to mix separate components
- Fast and versatile polymerization controlled by temperature
- Fills and self-levels after dispensing
- Heat dissipation from PCB systems to increase reliability
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DOWSIL™ 3-1944 RTV Coating
- Single-component, does not require mixing
- Good fluidity
- After dispensing, it is capable of flowing, filling or self-leveling
- Faster inline machining with optional thermal acceleration
- No solvent added
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
- UV indicator enables automatic inspection
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DOWSIL™ 3-1953 Conformal Coating
- No solvent added
- Polymerization at room temperature
- Slight thermal acceleration can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
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DOWSIL™ 3-1965 Conformal Coating
- No solvent added
- Polymerization at room temperature
- It can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Improves reliability against stresses
- Promotes flow and filling of narrow spaces and crevices
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DOWSIL™ 3-4150 Dielectric Gel Kit
- Green when mixed
- Rapid polymerization at room temperature
- Reduces the risk of loading errors
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DOWSIL™ 3-4207 Dielectric Tough Gel Kit
- When properly mixed, the gel is green
- Conditional adhesion without primer at room temperature
- Hardened gel for increased mechanical strength
- UV indicator enables automatic inspection
- Increased flame resistance
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DOWSIL™ 3-4241 Dielectric Tough Gel Kit
- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Good mechanical strength
- Contains UV indicator for inspection
- Adhesion without the use of primer
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
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DOWSIL™ 3-6096 Adhesive
- Addition curing system
- Cures into a durable and flexible rubber
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Rapid thermal polymerization
- Excellent heat resistance (up to 250ºC)
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DOWSIL™ 3-6371 UV Gel
- UV curing in 1 part
- Very soft
- Suitable for very low temperatures
- Does not require mixing
- UV rays for fast processing speed
- Polymerization secondary to moisture
- The gel remains flexible even at very low temperatures
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ 3-8219 RF Silicone Foam
- Medium hardness (Shore 00)
- Promotes application on sloping surfaces
- Easy to use
- Mixing ratio
- Rapid polymerization at room temperature
- It does not require temporary storage of the
- equipped parts
- Low compression set maintained at high service temperatures
- Stable and flexible over a wide range of temperatures
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DOWSIL™ 3-8259 RF Silicone Foam
- Medium hardness (Shore 00)
- Reduced flow favors application on sloping surfaces
- Easy to use, handy 1:1 mixing ratio
- Rapid curing at room temperature, with no need for temporary storage of the equipped parts
- Low compression set that is maintained at high service temperatures service temperatures
- Stable and flexible over a wide range of temperatures
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DOWSIL™ 3140 RTV Coating
- Single-component
- Does not require mixing
- Good fluidity
- Capable of flowing, filling or self-leveling
- Polymerization at room temperature
- No solvent added
- UV indicator for manual and automatic inspections
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DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
- Mellow
- High tensile strength and elongation resistance
- High thermal stability
- Single component - Does not require mixing
- Polymerization at room temperature
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
- Mellow
- Polymerization in rapid RTV
- Good "green" resistance
- Single-component - No mixing required
- Polymerization at room temperature
- Fast skin time
- High self-extinguishing
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DOWSIL™ 340 Heat Sink Compound
- Not smooth
- Moderate thermal conductivity
- Does not require ovens or curing
- Heat flow away from circuit components can increase reliability

Dowsil

Filtri

Product type

Brands

Technology

Applications

DOWSIL™ 1-2577 Conformal Coating

DOWSIL™ 1-2577 Low VOC Conformal Coating

DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating

DOWSIL™ 1-2620 Low VOC Conformal Coating

DOWSIL™ 1-4173 Thermally Conductive Adhesive

DOWSIL™ 3-1944 RTV Coating

DOWSIL™ 3-1953 Conformal Coating

DOWSIL™ 3-1965 Conformal Coating

DOWSIL™ 3-4150 Dielectric Gel Kit

DOWSIL™ 3-4207 Dielectric Tough Gel Kit

DOWSIL™ 3-4241 Dielectric Tough Gel Kit

DOWSIL™ 3-6096 Adhesive

DOWSIL™ 3-6371 UV Gel

DOWSIL™ 3-6753 Thermally Conductive Adhesive

DOWSIL™ 3-8219 RF Silicone Foam

DOWSIL™ 3-8259 RF Silicone Foam

DOWSIL™ 3140 RTV Coating

DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant

DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant

DOWSIL™ 340 Heat Sink Compound

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