Product Type for Electronics

Thermally conductive materials electronics

Learn about all Mascherpa’s solutions of thermally conductive materials for the thermal interface of an electronic circuits.

Why do I need a thermal interface material.

Electronic devices create heat, this heat slows down the speed of the device and over time will degrade the component, thus affecting its performance.

With greater miniaturization of systems and higher circuit density, current electronics generate large amounts of heat. This trend, will continue to require the removal of this excess energy, which will be even more critical for future applications. If the heat is not absorbed and dissipated, the life and reliability of the electronics will be reduced.

Heat is transferred from a component to its surroundings. The rate of heat loss will increase with the surface area of the component; a small device producing 10 watts will reach a higher temperature than a device of similar power with a larger surface area.

Heatsinks

  • Heat sinks can be designed to offer greatly increased surface area to maximize heat dissipation, but nevertheless in order to ensure full contact between the heat sink and the component, only through thermal interface materials will the maximum degree of thermal dissipation be achieved.

Purpose of thermally conductive materials

  • Metal surfaces, even when thoroughly polished, always show some roughness. Therefore, it can be inferred that when two metal surfaces, such as those between the heat sink and the component are placed together, there will always be small air spaces between the two surfaces.
  • Thermal interface materials are used in such gaps to fill the air spaces and ensure complete contact between the two surfaces, improving the efficiency of heat transfer.

E-Mobility – Thermal Management for Batteries in Electric Vehicles

Battery Thermal Management – Watch the video

Products

    • Provides excellent electromagnetic shielding
    • Ideal for wood and drywall
    • Ideal for musical instruments
    • Non-flammable and without harmful odors
    • Low VOC content
    • Provides excellent EMI/RFI shielding over a wide frequency range
    • Non-flammable and without harmful odors
    • Shipping as non-DG by air
    • Low VOC content
    • Provides effective EMF shielding
    • Ideal for wood and drywall
    • Ideal for shielding the cavities of electric guitars
    • Non-flammable and without harmful odors
    • Low VOC content
    • Upper EMI shielding
    • Polymerization at room temperature and high
    • Excellent chemical and corrosion resistance
    • Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
    • Resists wave soldering
    • Without MEK and HAPS
    • Good conductivity
    • Provides good RFI shielding
    • Extreme durability and grip
    • Strong resistance to solvents
    • Excellent corrosion and salt spray resistance
    • Provides superior EMI shielding
    • Excellent adhesion to plastics
    • Minimum height of thin layer
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene, xylene or MEK
    • UL Recognized (File No. E202609)
    • Provides effective EMI/RFI shielding over a wide range of frequencies
    • Strong corrosion resistance
    • Gentle and safe solvent system on polystyrenes
    • HAP free-does not contain toluene, xylene, or MEK
    • Available in aerosol format
    • Provides >52 dB RFI shielding at frequencies <1 MHz
    • Excellent adhesion to plastics
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene or xylene
    • Low outgassing approved by NASA
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Low outgassing approved by NASA
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substratesStorage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • High electrical conductivity
    • Creates strong permanent electrical connections
    • No mixing is required
    • Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
    • Storage at room temperature (≤ 22 °C)
    • Suitable for automated distribution
    • Thermal conductivity of 1.4 W/(m-K)
    • Mixing ratio 1:1
    • Processing time: 45 minutes
    • Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
    • Provides strong electrical insulation
    • High mechanical strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Thermal conductivity of 0.8 W/(m-K)
    • Mixing ratio 1:1
    • Fire retardant - UL 94V-0 registered
    • Processing time: 5 minutes
    • Laying time: 15 minutes
    • Provides strong electrical insulation
    • Low CTE before Tg
    • High tensile and compressive strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
    • High thermal conductivity
    • No mixing is required before use
    • Provides strong electrical insulation
    • Low curing temperature (<100 °C)
    • Storage at room temperature (≤ 22 °C)
    • Binds well to a wide variety of substances
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Good thermal conductivity
    • Low oil bleed
    • Stable at high temperatures
    • Mixing ratio: 1 to 1
    • Highly fluent
    • Self-leveling
    • Versatile thermal polymerization
    • Ensures heat flow away from components
    • With 7 mil glass microspheres
    • Check the thickness of the adhesion line
    • Without added solvents
    • Solvent-free formulation
    • Easy application
    • Low thermal resistance
    • High thermal conductivity
    • Good stability and reliability
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
    • Can be used as a printable PAD
    • Can replace the traditional manufactured pad
    • Use as a gap filler
    • Dispensed or printed through manual or automated processes
    • Deposit of features for precise coverage of components
    • Lower cost of ownership than manufactured pads
    • Excellent thermal performance
    • Soft, stress-relieving and shock-dampening
    • Reworkable
    • Moderate thermal conductivity
    • One part: no ovens or curing required
    • Pulls heat away from critical components
    • Not smooth
    • Moderate thermal conductivity
    • Does not require ovens or curing
    • Heat flow away from circuit components can increase reliability
    • Rapid polymerization in RT, without notches
    • Not smooth
    • Higher thermal conductivity
    • Controlled volatility of silicone
    • No mixing required
    • Polymerization at room temperature
    • Faster processing at room temperature
    • Used if increased flame resistance is required
    • Polymerization at room temperature
    • Long-term performance stability up to 150°C
    • Low compression stress
    • Maintains upright position (cured or uncured state)
    • Controlled volatility of silicone
    • Solvent-free formulation
    • Sliding
    • Does not polymerize
    • Able to achieve bond line thickness
    • Very low thermal resistance
    • High thermal conductivity
    • Wicks heat away from sensitive components
    • Polymer matrix helps reduce pump out
    • Fluid
    • Good thermal conductivity
    • Low thermal resistance
    • Does not polymerize
    • Heat removal from PCB system components
    • Possible to obtain bond line thickness (BLT).
    • One-component adhesive
    • Thermally conductive
    • Polymerizes with moisture
    • Fast drying to the touch
    • Good adhesion
    • Self-leveling
    • Controlled volatility (controlled migration of silanes)
    • Thermal conductivity at elevated temperatures
    • Very low oil separation
    • Excellent anti-creep characteristics
    • Wide range of operating temperatures
    • Low evaporation weight loss
    • Optimal heat dissipation efficiency
    • Also facilitates application by screen printing
    • Non-hardening paste
    • Allows for easy rework
    • High thermal conductivity
    • Optimal heat dissipation
    • Low viscosity for easy application
    • Used as thermal interface material
    • Based on a non-silicone oil
    • Avoids migration problems of silicone and siloxane LMW
    • Non-curing paste
    • Enables simple and efficient rework of components
    • Increased adhesion strength
    • Can be used as a sealant or thermal adhesive
    • High thermal conductivity
    • Combines adhesive and heat dissipation properties
    • Very wide operating temperature range
    • Single-component
    • Not lumpy
    • Ideal if high viscosity product required
  • No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
    • General purpose thermal management paste
    • Excellent stability under a wide range of conditions
    • Silicone oil-based
    • Wide operating temperature range
    • Good thermal conductivity
    • Use as a thermal interface material
    • Non-curing paste
    • Allows rework of components
    • Hot polymerization
    • High tensile strength
    • Single component - Does not require mixing
    • Fast and versatile curing with heat input fill or self-leveling after deployment

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