Products

    • Rapid handling of bonded components: rapidly develops adhesive strength at room temperature, enabling rapid handling of components.
    • Adheres to suitably prepared polypropylene.
    • Two-component system with 10:1 mixture ratio by weight. Non-corrosive and low-odor curing.
    • It contains no solvents.
    • The non-lumpy nature of the mixture allows the extruded bead to remain in place without flowing.
    • Excellent resistance to weathering, UV rays and heat up to 190°C.
    • Available in two color versions: Gray (RAL 7038) and Black (RAL 7016).
    • Rapid polymerization
    • Suitable for very low temperatures
    • Rapid thermal polymerization to speed up processing
    • Gel remains flexible in ultra-low temperature applications
    • Superior sealing characteristics when exposed to fuels and oils
    • Easily injected and reinjected
    • Does not harden
    • Good grip
    • Essentially unaffected by shock, vibration, and thermal cycling
    • Contains no hardeners or curing agents
    • Withstands immersion in fuels and exposure to fuel vapors at temperatures up to +200°C
    • Contains flow control particles
    • Excellent flow characteristics allow faster injection at lower pressures.
    • Two-component - Mixing ratio 1:1
    • Hot polymerization
    • High tensile strength
    • Good processing time after mixing
    • No solvent added
    • Fast and versatile polymerization controlled by temperature
    • Self-leveling
    • Cleaning solvent
    • Contains a special catalyst for adhesion preparation
    • Easy to apply
    • Ready to use
    • Cleaning and surface preparation in one step
    • Increased security
    • Moderate thermal conductivity
    • One part: no ovens or curing required
    • Pulls heat away from critical components
    • Mellow
    • Two-component - 10:1 mixing ratio
    • High tensile strength
    • Good processing time after mixing
    • Hot polymerization
    • One-component adhesive
    • Thermally conductive
    • Polymerizes with moisture
    • Fast drying to the touch
    • Good adhesion
    • Self-leveling
    • Controlled volatility (controlled migration of silanes)
    • Rapid polymerization in RT
    • Low viscosity
    • Controlled volatility of silicone
    • No solvent added
    • Rapid polymerization in RT, without notches
    • Medium viscosity
    • Polymerizes into a soft, low-stress elastomer
    • Without added solvents
    • Slight thermal acceleration can speed up in-line processing
    • Soft coating can improve reliability against stresses
    • Rapid polymerization in RT, without notches
    • Not smooth
    • Higher thermal conductivity
    • Controlled volatility of silicone
    • No mixing required
    • Polymerization at room temperature
    • Faster processing at room temperature
    • Used if increased flame resistance is required
    • Rapid polymerization in RT
    • Mellow
    • High elongation
    • Controlled volatility of silicone
    • Single-component - No mixing required
    • Volatility-controlled silicone
    • Polymerizes into a soft and elastic elastomer
    • No solvent added
    • Single-component - No mixing required
    • Polymerization at room temperature
    • Rapid polymerization
    • Very low viscosity
    • Controlled volatility of silicone
    • Solvent-free
    • Excellent smoothness, filling or self-leveling after distribution
    • Polymerizes into a soft, low-stress elastomer
    • Coating can improve reliability against stresses
    • Mellow
    • Controlled volatility of silicone
    • Single-component - No mixing required
    • Polymerization at room temperature
    • Self-extinguishing UL94 V-0
    • Rapid polymerization
    • Sliding
    • Polymerizes into a soft, low-stress elastomer
    • Controlled volatility of silicone
    • No solvent added
    • Polymerization at room temperature
    • Faster processing at room temperature with thermal acceleration
    • Soft coating can improve reliability against stresses
    • Can be used if flame resistance required
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Good adhesion on many substrates
    • Can be used as a printable PAD
    • Can replace the traditional manufactured pad
    • Use as a gap filler
    • Dispensed or printed through manual or automated processes
    • Deposit of features for precise coverage of components
    • Lower cost of ownership than manufactured pads
    • Excellent thermal performance
    • Soft, stress-relieving and shock-dampening
    • Reworkable
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
    • Polymerization at room temperature
    • Long-term performance stability up to 150°C
    • Low compression stress
    • Maintains upright position (cured or uncured state)
    • Controlled volatility of silicone