Products

Showing 241–260 of 657 results

  • Good tensile strength High adhesive capacity Low thermal conductivity Good weather resistance Two-component with room temperature curing Stable even at high temperatures
    • Two-part silicone elastomer encapsulant
    • Low thermal vacuum outgassing
    • Physical and electrical stability
    • Wide operating temperature range.
    • Certified to NASA requirements for extreme environment applications.
    • Single-component adhesive/sealant
    • Cures at room temperature when exposed to air humidity
    • Alkoxyl polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Excellent primerless adhesion to many substrates
    • Non-corrosive for metals
    • Stable and flexible from -50°C to +150°C
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition
    • One-component silicone conformal coating
    • Translucent
    • Low viscosity
    • Moisture cure (RTV)
    • Solvent-free
    • Provides environmental resistance
    • Dielectric protection
    • Long-term reliability even in harsh environmental conditions
    • UL recognized and includes a UV indicator for coating inspection.
    • Low viscosity
    • Good thermal conductivity
    • Mixing ratio 1 to 1
    • Polymerization at room temperature
    • Easy to mix and use
    • Good smoothness for fast processing and short cycle times
    • Promotes heat dissipation
    • Low ionic impurities
    • Very high thermal conductivity
    • Loaded silver
    • Good adhesion to Ni, Al, laminate and silicon
    • Microelectronic grade material
    • High electroconductive performance
    • Good adhesive performance for TIM1 applications
    • Two-component adhesive sealant
    • Rapid polymerization at room temperature
    • Neutral alkoxide polymerization
    • Pasty, non-self-levelling consistency
    • Good and durable adhesion
    • Excellent weather, UV and heat resistance up to 190°C
    • Rapid curing allows rapid handling of bonded components
    • Deep polymerization
    • Two-component adhesive sealant
    • Rapid polymerization at room temperature
    • Neutral alkoxide polymerization
    • Pasty, non-self-levelling consistency
    • Good and durable adhesion
    • Excellent weather, UV and heat resistance up to 190°C
    • Rapid curing allows rapid handling of bonded components
    • Deep polymerization
    • Fast and homogeneous deep polymerization
    • Early adhesion at room temperature
    • Pasty, non-self-levelling consistency
    • Rapid handling of bonded components
    • Fast assembly process
    • Durable adhesion to a wide variety of substrates
    • Excellent resistance to weathering and U.V. rays.
    • Two-part silicone adhesive
    • Non-sag
    • Fast low-temperature cure
    • Accelerated cure at moderate temperature (80 °C)
    • Rapid adhesion development.
    • The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
    • Maintains physical and electrical properties across a wide range of operating conditions.
    • Primerless adhesion
  • No mixing required No reaction exotherm during curing Excellent primerless adhesion on many substrates Excellent performance across a wide temperature range Cures into soft, low-stress elastomers Controlled volatility (controlled silane migration)
    • Electromagnetic shielding
    • Easy to dose and cure at room temperature
    • Dow's unique formulation enables adhesion to a variety of substrates
    • Durable mechanical and conductive properties, reliable performance
    • High electrical conductivity (silver-based filler)
    • Electromagnetic shielding (EMC) over a wide frequency range
    • High elongation for stress relief (>20%)
    • Non-slump adhesive (non-flowable)
    • UV traceability for inspection
    • Good adhesion on various substrates
    • Solvent-free formulation
    • Reduces pressure on components
    • Effectively dissipates heat
    • Avoids delamination problems
    • The rapid polymerization
    • Optimized processing time
    • Allows for the implementation of complex projects
    • No additional dielectric barrier required
    • Allows for quick filling
    • It is suitable for high-throughput production processes.
    • Filling allows easy control of the process
    • Meets certification requirements
    • Gel is a two-component addition-cure silicone gel
    • Clear and flowable,
    • Designed for optically clear potting and coupling applications in displays and LED lighting systems.
    • High transparency
    • Reduced yellowing
    • High surface adhesion
    • Good stress absorption capacity
    • Provides mechanical protection, electrical insulation and long-term reliability.
    • Can cure at room temperature or with thermal acceleration.
    • Polymerization at room temperature
    • Low viscosity - ease of processing
    • Self-adhesive - no primer required
    • Reliable optical performance in difficult conditions
    • Meets BS 476 Part 22 standard
    • Excellent primerless adhesion on most substrates
    • porous and non-porous buildings
    • It does not drip
    • Joint movement capacity ±50%
    • Neutral curing system
    • Halogen-free
    • Complies with ISO 11600-F&G-25LM Standard
    • A fire resistance value of up to 4 hours can be obtained
    • Extensively tested on many European specifications
    • Out of footprint in 1.5 hours
    • Excellent weathering characteristics, including resistance to ozone, UV radiation and extreme temperatures
    • Long service life
    • CE marked as fire resistant according to ETAG 026
    • Two-component 1:1 optical silicone
    • Molding resin for optical applications
    • High light transmittance
    • Low chromatic dispersion
    • UV and heat resistant
    • High surface detail replication
    • High Shore A
    • Fast heat curing