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Showing 201–220 of 657 results

    • Green when mixed
    • Rapid polymerization at room temperature
    • Reduces the risk of loading errors
    • When properly mixed, the gel is green
    • Conditional adhesion without primer at room temperature
    • Hardened gel for increased mechanical strength
    • UV indicator enables automatic inspection
    • Increased flame resistance
    • Slow-curing two-component silicone dielectric gel
    • Good flame resistance
    • Good mechanical strength
    • Contains UV indicator for inspection
    • Adhesion without the use of primer
    • Cures extremely softly
    • Designed to insulate circuits from the damaging effects of moisture
    • Provides electrical insulation for high voltages
    • Protects circuits and interconnections from thermal stresses
    • Low viscosity
    • Odorless
    • Addition curing system
    • Cures into a durable and flexible rubber
    • Excellent adhesion to a wide range of substrates such as glass, metals and plastics
    • Rapid thermal polymerization
    • Excellent heat resistance (up to 250ºC)
    • Black one-component silicone adhesive
    • Thixotropic and non-sagging
    • Thermal addition cure polymerization
    • High tensile strength
    • Reduced void formation after curing, even on sensitive substrates
    • UL 94 V-0 rated
    • UV curing in 1 part
    • Very soft
    • Suitable for very low temperatures
    • Does not require mixing
    • UV rays for fast processing speed
    • Polymerization secondary to moisture
    • The gel remains flexible even at very low temperatures
    • Two-component fire-resistant RTV silicone foam
    • Two-component room temperature vulcanizing (RTV) silicone foam
    • Fire resistant
    • Good flexibility even under severe operating conditions
    • Withstand high temperatures
    • Designed to limit hazards such as smoke, flames and gases.
    • Expands and cures at room temperature to form a closed-cell foam elastomer.
    • Designed for creating fire-resistant seals in penetrations and linear joints.
    • Mixing ratio: 1 to 1
    • Highly fluent
    • Self-leveling
    • Versatile thermal polymerization
    • Ensures heat flow away from components
    • With 7 mil glass microspheres
    • Check the thickness of the adhesion line
    • Without added solvents
    • Medium hardness (Shore 00)
    • Promotes application on sloping surfaces
    • Easy to use
    • Mixing ratio
    • Rapid polymerization at room temperature
    • It does not require temporary storage of the
    • equipped parts
    • Low compression set maintained at high service temperatures
    • Stable and flexible over a wide range of temperatures
    • Medium hardness (Shore 00)
    • Reduced flow favors application on sloping surfaces
    • Easy to use, handy 1:1 mixing ratio
    • Rapid curing at room temperature, with no need for temporary storage of the equipped parts
    • Low compression set that is maintained at high service temperatures service temperatures
    • Stable and flexible over a wide range of temperatures
    • Single-component
    • Does not require mixing
    • Good fluidity
    • Capable of flowing, filling or self-leveling
    • Polymerization at room temperature
    • No solvent added
    • UV indicator for manual and automatic inspections
    • Mellow
    • High tensile strength and elongation resistance
    • High thermal stability
    • Single component - Does not require mixing
    • Polymerization at room temperature
    • Mellow
    • Polymerization in rapid RTV
    • Good "green" resistance
    • Single-component - No mixing required
    • Polymerization at room temperature
    • Fast skin time
    • High self-extinguishing
    • Not smooth
    • Moderate thermal conductivity
    • Does not require ovens or curing
    • Heat flow away from circuit components can increase reliability
    • Rapid digestion of cured silicone sealant
    • Non-halogenated solvent
    • Non-flammable
    • Adhesion to metals and plastics
    • Weathering resistance
    • UV resistance
    • Non-corrosive
    • Neutral polymerization
    • Not oily
    • Ready to use
    • Short time of no adherence
    • Solvent-free: low shrinkage
    • Good mechanical properties: high
    • Tear resistance
    • Elongation resistance
    • Tensile strength
    • One-part dielectric gel
    • Transparent
    • Hot polymerization
    • Low viscosity
    • Very soft gel
    • Suitable for PCB potting and electronic component protection
    • Electrical insulation and environmental protection
    • Extended temperature range (-60°C / +200°C)
    • No mixing required
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
    • Non-curing
    • High thermal conductivity
    • Stable on vertical surfaces
    • Gap filling capacity up to 1.0 mm
    • Thermally conductive silicone material
    • Low thermal resistance and good high-temperature stability
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing