Products

    • Single-component
    • Does not require mixing
    • Good fluidity
    • Capable of flowing, filling or self-leveling
    • Polymerization at room temperature
    • No solvent added
    • UV indicator for manual and automatic inspections
    • Mellow
    • High tensile strength and elongation resistance
    • High thermal stability
    • Single component - Does not require mixing
    • Polymerization at room temperature
    • Mellow
    • Polymerization in rapid RTV
    • Good "green" resistance
    • Single-component - No mixing required
    • Polymerization at room temperature
    • Fast skin time
    • High self-extinguishing
    • Not smooth
    • Moderate thermal conductivity
    • Does not require ovens or curing
    • Heat flow away from circuit components can increase reliability
    • Rapid digestion of cured silicone sealant
    • Non-halogenated solvent
    • Non-flammable
    • Adhesion to metals and plastics
    • Weathering resistance
    • UV resistance
    • Non-corrosive
    • Neutral polymerization
    • Not oily
    • Ready to use
    • Short time of no adherence
    • Solvent-free: low shrinkage
    • Good mechanical properties: high
    • Tear resistance
    • Elongation resistance
    • Tensile strength
    • Not smooth
    • Low levels of volatile condensable materials
    • High elongation for greater stress reduction
    • No mixing required
    • Faster inline machining with optional thermal acceleration
    • Proven for space applications
    • One-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Alkoxyl polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Excellent adhesion to many substrates
    • Stable and flexible from -40°C (-40°F) to 180°C (356°F)
    • Provides instant green force
    • Easy-to-use one-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Excellent adhesion to a wide range of substrates such as glass, metals and plastics
    • Pasty and non-sticky consistency
    • Cures into a durable and flexible rubber
    • Stable and flexible from -50°C to +150°C
    • UL 94 HB
    • Rapid resistance formation promotes increased productivity due to rapid handling of bonded units
    • Saves time because no buffer is needed for increasing resistance
    • One-component adhesive sealant
    • Cures at room temperature when exposed to moisture in the air
    • Alkoxy polymerization system
    • Pasty consistency, does not bag
    • Easy to apply
    • Low modulus for high movement capacity
    • Good adhesion on many substrates
    • Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
    • One-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Alkoxyl polymerization system
    • Fluid and self-leveling
    • Easy to apply
    • Excellent primerless adhesion to many substrates
    • Stable and flexible from -50°C to +180°C
    • Non-corrosive to metals
    • Low odor
    • Primerless adhesion to mixed substrates
    • One-component fluorosilicone sealant adhesive.
    • It cures at room temperature when
    • exposed to moisture in the air
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Good adhesion to many substrates
    • Stable and flexible from -65°C (-85°F) to 260°C (500°F)
    • Retains its properties when exposed to fuels, oils and solvents
    • One-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Good adhesion to many substrates
    • Stable and flexible from -60°C to +180°C (-76°F to +356°F), with short peaks up to +205°C (401°F)
    • Black version: stable and flexible from -60°C to +205°C (-76°F to +401°F), with short peaks up to +230°C (446°F)
    • Excellent dielectric properties
    • One-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Fluid and self-leveling
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Rapid no-grip time
    • Good adhesion to many substrates
    • Stable and flexible from -65°C (-85°F) to +180°C (+356°F)
    • Excellent dielectric properties
    • It does not sag and drip
    • Can be applied overhead or on side walls
    • Can be used in applications with continuous exposure at 260°C (500°F) and intermittent exposure at 315°C (600°F)
    • Not smooth
    • Polymerization at room temperature
    • High elongation for greater stress reduction
    • No mixing required
    • Polymerization at room temperature, no need for ovens
    • Faster inline machining with optional thermal acceleration
    • Improved reliability through reduced curing stresses
    • Automated or manual needle dispensing systems
    • Mellow
    • High elongation by stress reduction
    • Single-component - No mixing required
    • Polymerization at room temperature
    • High self-extinguishing
    • Cures at room temperature
    • Pasty consistency
    • It does not drip
    • Easy to apply
    • High elongation
    • Stable and flexible over a wide temperature range
    • Can be used in corrosion-sensitive electrical equipment and PCB systems without adverse effects
    • Easy to handle
    • UL Classified
    • Non-corrosive
    • Low odor
    • Cures at room temperature
    • Single-component adhesive/sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Good adhesion on many substrates
    • Stable and flexible from -50°C (-58°F) to 180°C (356°F)