>-55 / <150 °C

    • General use
    • Low viscosity
    • Addition curing system
    • No polymerization by-products
    • Self-healing gel
    • Permanent pressure-sensitive adhesion
    • Excellent dielectric properties
    • Long-term sealing against atmospheric contaminants
    • Seals and protects PCBs and electronic devices
    • Used for delicate electrical devices
    • Offers excellent flexibility
    • Cures even at room temperature
    • Isolate circuits from harmful effects
    • Special class of encapsulants
    • Polymerizes into an extremely soft material
    • Protects circuits and interconnections
    • Operational over a wide temperature range