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    • Single-component, does not require mixing
    • Good fluidity
    • After dispensing, it is capable of flowing, filling or self-leveling
    • Faster inline machining with optional thermal acceleration
    • No solvent added
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
    • UV indicator enables automatic inspection
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance