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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Cures to a robust surface
    • Resilient and abrasion resistant
    • Solvent-based resin coating
    • Polymerization at room temperature
    • Possibility of acceleration after solvent spillage
    • UV indicator for inspection
    • Allows use with many low-solids lead-free solder
    • Low viscosity improves flow and
    • fill tight spaces and gaps
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
    • Mellow
    • Two-component - 10:1 mixing ratio
    • High tensile strength
    • Good processing time after mixing
    • Hot polymerization
    • Rapid polymerization in RT
    • Mellow
    • High elongation
    • Controlled volatility of silicone
    • Single-component - No mixing required