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    • Cures to a robust surface
    • Resilient and abrasion resistant
    • Solvent-based resin coating
    • Polymerization at room temperature
    • Possibility of acceleration after solvent spillage
    • UV indicator for inspection
    • Allows use with many low-solids lead-free solder
    • Low viscosity improves flow and
    • fill tight spaces and gaps
    • Single-component silicone conformal coating
    • Transparent
    • Thermal polymerization
    • Designed for the protection of rigid and flexible printed circuit boards.
    • Low viscosity
    • Without added solvents
    • Cures into a soft, low-stress elastomer, reducing stress on electronic components.
    • Incorporates a UV indicator to facilitate automated inspection
    • UL, IPC and MIL certified.
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
    • One-part condensation cure silicone sealant
    • Space grade
    • Non-sag
    • Low controlled volatility
    • Cures at room temperature upon exposure to moisture
    • Does not require mixing
    • Designed for aerospace applications
    • Provides high elongation
    • Good physical and electrical stability
    • Complies with NASA low outgassing requirements
    • Protects components from extreme temperatures, high humidity, thermal shock, radiation, atomic oxygen, and mechanical vibration
    • Mellow
    • Two-component - 10:1 mixing ratio
    • High tensile strength
    • Good processing time after mixing
    • Hot polymerization
    • Rapid polymerization in RT
    • Mellow
    • High elongation
    • Controlled volatility of silicone
    • Single-component - No mixing required