Heat-conductive adhesive

    • Provides superior EMI shielding
    • Excellent adhesion to plastics
    • Minimum height of thin layer
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene, xylene or MEK
    • Upper EMI shielding
    • Polymerization at room temperature and high
    • Excellent chemical and corrosion resistance
    • Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
    • Resists wave soldering
    • Without MEK and HAPS
    • Provides excellent EMI/RFI shielding over a wide frequency range
    • Non-flammable and without harmful odors
    • Shipping as non-DG by air
    • Low VOC content
    • Provides excellent electromagnetic shielding
    • Ideal for wood and drywall
    • Ideal for musical instruments
    • Non-flammable and without harmful odors
    • Low VOC content
    • High electrical conductivity
    • Creates strong permanent electrical connections
    • No mixing is required
    • Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
    • Storage at room temperature (≤ 22 °C)
    • Suitable for automated distribution
    • High thermal conductivity
    • No mixing is required before use
    • Provides strong electrical insulation
    • Low curing temperature (<100 °C)
    • Storage at room temperature (≤ 22 °C)
    • Binds well to a wide variety of substances
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons