Epoxy adhesives

Showing 1–20 of 77 results

    • Two-component epoxy adhesive
    • Halogen-free
    • Compliant with FST (Flame, Smoke, Toxicity) requirements
    • Self-extinguishing
    • Thixotropic paste formulation
    • Room temperature curing
    • Ultra-low density syntactic epoxy adhesive
    • Easily pumpable
    • Non-sag after application
    • Good resistance to vibrational fatigue
    • Designed to reduce cracking tendency in high-stress applications
    • Ultra-low density syntactic epoxy adhesive
    • Non-sag
    • Designed for edge sealing and void filling
    • High compressive strength-to-density ratio
    • Manual or extrusion application
    • High resistance to cutting and stripping
    • Hard and resilient
    • Good resistance to dynamic load
    • Combines a wide range of commonly used materials
    • High resistance to cutting and stripping
    • Hard and resilient
    • Rapid polymerization
    • Combines a wide range of materials
    • Two-component epoxy adhesive for fast bonding
    • Versatile solution for general-purpose applications
    • Suitable for bonding a wide variety of materials
    • High strength and toughness
    • Fluid consistency for easy application
    • Also suitable for potting small components
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • Cures at room temperature
    • High strength and toughness
    • Thixotropic
    • Good environmental and chemical resistance
    • Metal bonding
    • Bonding of commonly used materials
    • Two-component epoxy adhesive for high-strength bonding
    • Specifically designed for bonding metals and rigid materials
    • Good resistance to environmental and chemical agents
    • Suitable for vertical applications thanks to its sag resistance
    • Suitable for multi-material bonding
    • High strength and toughness
    • Suitable for gap filling
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • Resistance to high temperatures
    • Resistant to chemicals
    • Water resistant
    • Resistant to chemicals
    • It fills the games
    • It does not drip down to 5 mm
    • Two-component epoxy adhesive for durable bonds
    • High resistance to high temperatures
    • High resistance to chemicals and harsh environmental conditions
    • Low shrinkage for durable bonding
    • Suitable for filling gaps up to 5 mm
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • Tenacious
    • Ideal for bonding GRP, SMC and dissimilar substrates
    • Fills in gaps, does not drip up to 10 mm thick
    • Good resistance to weathering
    • Two-component toughened epoxy adhesive
    • High toughness for durable and resilient joints
    • Resistant to dynamic loads and vibrations
    • Particularly suitable for bonding GRP, SMC, and dissimilar materials
    • Good resistance to environmental conditions
    • Thixotropic and sag-resistant
    • High gap-filling properties
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • High shear strength
    • Paste a wide variety of materials (metal, composites, and thermoplastics)
    • Resistant to temperatures up to 140°C
    • Extremely tenacious and resilient adhesive
    • Contains spacers to ensure a minimum bond line thickness of 0.05 mm
    • Low viscosity, transparent adhesive
    • Especially suitable for joining glass and ceramics
    • Suitable for transparent materials
    • Glass-like refractive index
    • Two-component transparent and colorless epoxy adhesive
    • Low viscosity for high flowability
    • Particularly suitable for bonding glass and ceramic
    • Suitable for transparent casting, laminates and component encapsulation
    • Refractive index similar to glass
    • Good water resistance
    • Suitable for transparent assemblies and electronic applications
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • Thixotropic, non-sagging
    • Tenacious and resilient adhesive
    • Suitable for bonding metals and composites
    • High resistance to weathering
    • Provides an adhesion thickness of 0.05 mm
    • Two-component epoxy system
    • FST Properties (Fire, Smoke, Toxicity)
    • Intrinsically flame retardant
    • Low viscosity for infusion and RTM processes
    • Heat curing
    • High mechanical performance
    • Resistant to cutting and peeling
    • Bonding a wide variety of materials
    • Good resistance to moisture
    • Extremely tenacious and resilient adhesive
    • Two-component epoxy adhesive
    • Low-viscosity system
    • Good substrate wetting
    • Room temperature curing
    • Two-component epoxy adhesive for high-strength industrial bonding
    • High chemical resistance
    • Excellent performance at high temperatures
    • Suitable for aggressive operating environments
    • Thixotropic and suitable for gap filling
    • Suitable for multi-material bonding
    • Suitable for heavy-duty industrial applications
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling