Epoxy adhesives
Showing 1–20 of 63 results
Filtri

Tipo di prodotto
- 27 Structural adhesive
Marchio
Tecnologia
Applicazioni
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- Two-component epoxy adhesive
- Halogen-free
- Compliant with FST (Flame, Smoke, Toxicity) requirements
- Self-extinguishing
- Thixotropic paste formulation
- Room temperature curing
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- Ultra-low density syntactic epoxy adhesive
- Easily pumpable
- Non-sag after application
- Good resistance to vibrational fatigue
- Designed to reduce cracking tendency in high-stress applications
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- Ultra-low density syntactic epoxy adhesive
- Non-sag
- Designed for edge sealing and void filling
- High compressive strength-to-density ratio
- Manual or extrusion application
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- High resistance to cutting and stripping
- Hard and resilient
- Good resistance to dynamic load
- Combines a wide range of commonly used materials
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- High resistance to cutting and stripping
- Hard and resilient
- Rapid polymerization
- Combines a wide range of materials
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- Cures at room temperature
- High strength and toughness
- Thixotropic
- Good environmental and chemical resistance
- Metal bonding
- Bonding of commonly used materials
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- Resistance to high temperatures
- Resistant to chemicals
- Water resistant
- Resistant to chemicals
- It fills the games
- It does not drip down to 5 mm
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- Tenacious
- Ideal for bonding GRP, SMC and dissimilar substrates
- Fills in gaps, does not drip up to 10 mm thick
- Good resistance to weathering
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- High shear strength
- Paste a wide variety of materials (metal, composites, and thermoplastics)
- Resistant to temperatures up to 140°C
- Extremely tenacious and resilient adhesive
- Contains spacers to ensure a minimum bond line thickness of 0.05 mm
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- Low viscosity, transparent adhesive
- Especially suitable for joining glass and ceramics
- Suitable for transparent materials
- Glass-like refractive index
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- Thixotropic, non-sagging
- Tenacious and resilient adhesive
- Suitable for bonding metals and composites
- High resistance to weathering
- Provides an adhesion thickness of 0.05 mm
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- Resistant to cutting and peeling
- Bonding a wide variety of materials
- Good resistance to moisture
- Extremely tenacious and resilient adhesive
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- Two-component epoxy adhesive
- Low-viscosity system
- Good substrate wetting
- Room temperature curing
-
- Cures at room temperature
- High strength and toughness
- Thixotropic
- Good environmental and chemical resistance
- Metal bonding
- Bonding of commonly used materials
-
- Thixotropic, non-sagging
- Tenacious and resilient adhesive
- Suitable for bonding metals and composites
- High resistance to weathering
- Provides an adhesion thickness of 0.05 mm
-
- Tenacious
- Ideal for bonding GRP, SMC and dissimilar substrates
- Fills in gaps, does not drip up to 10 mm thick
- Good resistance to weathering
-
- High resistance to cutting and stripping
- Hard and resilient
- Good resistance to dynamic load
- Combines a wide range of commonly used materials
-
- Resistance to high temperatures
- Resistant to chemicals
- Water resistant
- Resistant to chemicals
- It fills the games
- It does not drip down to 5 mm
-
- High resistance to cutting and stripping
- Hard and resilient
- Rapid polymerization
- Combines a wide range of materials
-
- High shear strength
- Paste a wide variety of materials (metal, composites, and thermoplastics)
- Resistant to temperatures up to 140°C
- Extremely tenacious and resilient adhesive
- Contains spacers to ensure a minimum bond line thickness of 0.05 mm



















