Epoxy

Showing 1–20 of 25 results

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Araldite® CW 2243-1L
- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
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Araldite® CW 2245
- Good resistance to temperature shock
- Flexible jets
- Low viscosity
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Araldite® CY 221 / Aradur® HY 2966
- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
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Araldite® DBF
- Low viscosity casting resin
- High possibility of adding filler
- Encapsulation of electronic and low-voltage components
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Araldite® XB 2252-1 / XB 2253-1
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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Electrolube ER1122 Epoxy Resin
- Adhesion to a wide variety of substrates
- Good adhesion, even under difficult conditions
- The changeable mixing ratio for varying flexibility
- Good electrical properties
- Used as an adhesive or encapsulant
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Electrolube ER2183 Epoxy Resin
- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
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Electrolube ER2188 Epoxy Resin
- General purpose epoxy resin
- Economic solution
- Good chemical and water resistance
- Excellent adhesion to a wide variety of substrates
- Excellent electrical properties
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Electrolube ER2219 Epoxy Resin
- One-component epoxy encapsulant
- Semi-thixotropic
- Effective polymerization quickly
- High ionic purity
- Low ionizable chlorine content
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Electrolube ER2220 Epoxy Resin
- Flame retardant
- Uses nonabrasive fillers
- Used for encapsulation of PCBs.
- Suitable for effective heat dissipation
- Provides environmental protection
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Electrolube ER2221 Epoxy Resin
- Improved thermal conductivity
- Low viscosity for a loaded system
- Contains no abrasive fillers
- Low wear and tear on dosing machinery
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MG Chemicals 8329TCM
- Thermal conductivity of 1.4 W/(m-K)
- Mixing ratio 1:1
- Processing time: 45 minutes
- Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
- Provides strong electrical insulation
- High mechanical strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8329TFF
- Thermal conductivity of 0.8 W/(m-K)
- Mixing ratio 1:1
- Fire retardant - UL 94V-0 registered
- Processing time: 5 minutes
- Laying time: 15 minutes
- Provides strong electrical insulation
- Low CTE before Tg
- High tensile and compressive strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
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MG Chemicals 832FX
- Black, flexible two-part epoxy compound
- Designed to reduce physical stress on components
- Suitable for low-temperature environments and applications subject to thermal cycling or rapid temperature changes
- Mixing ratio 1:1 by volume
- Very low mixed viscosity of 700 cP
- Good adhesion to metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulation properties
- High resistance to water and moisture, even when submerged
- Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
- Solvent-free
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MG Chemicals 832HD
- Black, rigid two-part epoxy resin
- PCB potting compound
- Capable of filling small gaps and cavities
- Mixing ratio 1:1 by volume
- Low mixed viscosity of 4,100 cP
- High compressive and tensile strength
- Excellent adhesion to metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulation properties
- High resistance to water and humidity
- Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
- Solvent-free
- Room temperature or heat-accelerated curing
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MG Chemicals 832TC
- Black two-component thermally conductive epoxy resin
- Designed for applications where thermal management is a critical factor
- Thermal conductivity of 0.68 W/(m·K)
- Low exotherm
- Mixing ratio 1:1 by volume
- High compressive and tensile strength
- Excellent adhesion to metals, composites, glass, ceramics and numerous plastics
- Excellent electrical insulation properties
- High resistance to water and humidity
- Protection from electrostatic discharge, vibration, abrasion, thermal shock, moisture, salt water, fungus and aggressive chemicals
- Solvent-free
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MG Chemicals 8330D
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substratesStorage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8330S
- Low outgassing approved by NASA
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331D
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331S
- Low outgassing approved by NASA
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons