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Epoxy
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Electrically conductive adhesives
Electrically conductive adhesives
11
Resins and encapsulants
Resins and encapsulants
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Technology
Technology
Epoxy (11)
Applications
Applications
Applications
Capacitors (1)
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Araldite® CW 2243-1L
Low viscosity
Flexible jets
Good resistance to thermal shock
Semi-rigid system
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Araldite® CW 2245
Good resistance to temperature shock
Flexible jets
Low viscosity
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Araldite® CY 221 / Aradur® HY 2966
Good heat resistance
Resistant to atmospheric and chemical degradation
Good crack resistance
Excellent castability and impregnation
Mixing ratio 100:25 by weight
Elastic thermal shock absorberepentine system
Suitable for low-stress encapsulants
Excellent electrical properties
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Araldite® DBF
Low viscosity casting resin
High possibility of adding filler
Encapsulation of electronic and low-voltage components
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Araldite® XB 2252-1 / XB 2253-1
Good resistance to thermal shock
Good dielectric properties
Good mechanical properties
Excellent thermal resistance
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Electrolube ER1122 Epoxy Resin
Adhesion to a wide variety of substrates
Good adhesion, even under difficult conditions
The changeable mixing ratio for varying flexibility
Good electrical properties
Used as an adhesive or encapsulant
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Electrolube ER2183 Epoxy Resin
Thermally conductive epoxy
Easy to mix
Uses non-abrasive fillers
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Electrolube ER2188 Epoxy Resin
General purpose epoxy resin
Economic solution
Good chemical and water resistance
Excellent adhesion to a wide variety of substrates
Excellent electrical properties
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Electrolube ER2219 Epoxy Resin
One-component epoxy encapsulant
Semi-thixotropic
Effective polymerization quickly
High ionic purity
Low ionizable chlorine content
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Electrolube ER2220 Epoxy Resin
Flame retardant
Uses nonabrasive fillers
Used for encapsulation of PCBs.
Suitable for effective heat dissipation
Provides environmental protection
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Electrolube ER2221 Epoxy Resin
Improved thermal conductivity
Low viscosity for a loaded system
Contains no abrasive fillers
Low wear and tear on dosing machinery
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MG Chemicals 8329TCM
Thermal conductivity of 1.4 W/(m-K)
Mixing ratio 1:1
Processing time: 45 minutes
Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
Provides strong electrical insulation
High mechanical strength
Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8329TFF
Thermal conductivity of 0.8 W/(m-K)
Mixing ratio 1:1
Fire retardant - UL 94V-0 registered
Processing time: 5 minutes
Laying time: 15 minutes
Provides strong electrical insulation
Low CTE before Tg
High tensile and compressive strength
Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
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MG Chemicals 8330D
Extreme electrical conductivity
Convenient 1-to-1 mixing ratio
Processing time: 20 minutes
Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
Creates strong permanent electrical connections
Polymerization at room temperature
Without SVHC
Excellent adhesion to many substratesStorage at room temperature
Long shelf life
Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8330S
Low outgassing approved by NASA
Extreme electrical conductivity
Convenient 1-to-1 mixing ratio
Working time: 4 hours
Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
Creates strong permanent electrical connections
Excellent adhesion to many substrates
Storage at room temperature
Long shelf life
Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331D
High electrical conductivity
Convenient 1-to-1 mixing ratio
Processing time: 20 minutes
Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
Creates strong permanent electrical connections
Polymerization at room temperature
Without SVHC
Excellent adhesion to many substrates
Storage at room temperature
Long shelf life
Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331S
Low outgassing approved by NASA
High electrical conductivity
Convenient 1-to-1 mixing ratio
Working time: 4 hours
Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
Creates strong permanent electrical connections
Excellent adhesion to many substrates
Storage at room temperature
Long shelf life
Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 841ER
Good conductivity
Provides good RFI shielding
Extreme durability and grip
Strong resistance to solvents
Excellent corrosion and salt spray resistance
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MG Chemicals 842ER
Upper EMI shielding
Polymerization at room temperature and high
Excellent chemical and corrosion resistance
Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
Resists wave soldering
Without MEK and HAPS
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MG Chemicals 9410
High electrical conductivity
Creates strong permanent electrical connections
No mixing is required
Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
Storage at room temperature (≤ 22 °C)
Suitable for automated distribution
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