MG Chemicals 832HD

  • Black, rigid two-part epoxy resin
  • PCB potting compound
  • Capable of filling small gaps and cavities
  • Mixing ratio 1:1 by volume
  • Low mixed viscosity of 4,100 cP
  • High compressive and tensile strength
  • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
  • Excellent electrical insulation properties
  • High resistance to water and humidity
  • Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
  • Solvent-free
  • Room temperature or heat-accelerated curing

Additional information

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Brand
Technology
Dielectric strength (kV/mm)
Viscosity
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Polimerizzazione
Shore hardness
UL94 self-extinguishing
Thermal conductivity (W/m.K)
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