>5 / <15 min

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Two-component epoxy adhesive
    • Halogen-free
    • Compliant with FST (Flame, Smoke, Toxicity) requirements
    • Self-extinguishing
    • Thixotropic paste formulation
    • Room temperature curing
    • Ultra-low density syntactic epoxy adhesive
    • Easily pumpable
    • Non-sag after application
    • Good resistance to vibrational fatigue
    • Designed to reduce cracking tendency in high-stress applications
    • Ultra-low density syntactic epoxy adhesive
    • Non-sag
    • Designed for edge sealing and void filling
    • High compressive strength-to-density ratio
    • Manual or extrusion application
    • Two-component epoxy adhesive
    • Low-viscosity system
    • Good substrate wetting
    • Room temperature curing
    • Two-component epoxy system for composites
    • Amine system without reactive diluents
    • High flexibility and high reactivity
    • Suitable for hot processes
    • Good reinforcement impregnation
    • Toughened two-component epoxy system
    • Medium resin viscosity
    • Good toughness combined with low viscosity
    • Suitable for lamination and molding processes
    • Heat curing
    • Two-component epoxy system
    • Medium-viscosity toughened resin
    • Good toughness and mechanical strength
    • Suitable for lamination and molding processes
    • Heat curing
    • Two-component low-viscosity epoxy system
    • Long pot life
    • Good reinforcement impregnation
    • Room temperature curing with post-cure capability
    • Two-component high-temperature epoxy system
    • Low viscosity for RTM, SCRIMP, and VARTM processes
    • Long pot life
    • High glass transition temperature (Tg > 180 °C with post-cure)
    • Suitable for the production of composite parts and molds
    • Two-component syntactic epoxy system
    • Medium density and low specific weight
    • High mechanical strength
    • Pourable
    • Designed for honeycomb structure reinforcement and potting
    • No solvent added
    • Polymerization at room temperature
    • Slight thermal acceleration can speed up in-line processing
    • Good adhesion to many substrates
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
    • Transparent coating with excellent clarity
    • UV resistant
    • Ideal for LED applications
    • Reduces operational risks
    • Free of aromatic solvents such as toluene and xylene
    • Efficient application of coating at room temperature
    • Ideal for applications requiring rework
    • Can be removed with ULS
    • Provides excellent adhesion to all substrates
    • Good temperature range and dielectric properties
    • Can be welded through the UV track for easy inspection
    • Can be removed with solvents such as Ultrasolve (ULS)
    • Cheap
    • Enables efficient application
    • Fast drying time
    • Very low surface energy
    • Repels hydrocarbon and silicone oils
    • Low solids content
    • Low film strength once cured
    • Connectors do not require masking
    • Promotes economical and efficient application
    • Fast drying time
    • Simple coating procedure
    • Non-flammable coating that contains a UV trace
    • Ensures the quality of the coating by visual inspection
    • High resistance to surface insulation
    • Good resistance to wet environments
    • Flexible coating
    • Good resistance to a wide and variable temperature range
    • Ideal for applications requiring rework
    • Excellent performance in a wide range of harsh conditions
    • Approved in the military
    • Transparent coating with excellent clarity
    • Ideal for LED and UV-exposed applications
    • High adhesion to a wide variety of substrates
    • Resistant to mold growth
    • Ideal for applications requiring rework
    • High-temperature structural epoxy adhesive
    • Two-component epoxy adhesive
    • Service up to 149°C (300°F)
    • High shear strength on metals and composites
    • Thixotropic gap-filling paste
    • Contains 125-micron spacer beads
    • High Tg
    • High-strength structural epoxy adhesive
    • High shear and peel strength
    • Gap-filling with thixotropic behavior
    • Polymerization at room temperature
    • Fast handling strength
    • Good performance retention after environmental aging and chemical immersion
    • SVHC-free according to REACH
    • Structural applications
    • Room temperature curing paste
    • High toughness and resilience
    • Syntactic structural epoxy adhesive
    • Single-component supplied frozen
    • Paste consistency after thawing
    • Extrudable with standard equipment
    • Designed for structural applications on honeycomb