>120 min

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Araldite® CY 221 / Aradur® HY 2966
- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
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Araldite® XB 2252-1 / XB 2253-1
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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Electrolube ER1122 Epoxy Resin
- Adhesion to a wide variety of substrates
- Good adhesion, even under difficult conditions
- The changeable mixing ratio for varying flexibility
- Good electrical properties
- Used as an adhesive or encapsulant
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Electrolube ER2183 Epoxy Resin
- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
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Electrolube ER2188 Epoxy Resin
- General purpose epoxy resin
- Economic solution
- Good chemical and water resistance
- Excellent adhesion to a wide variety of substrates
- Excellent electrical properties
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Electrolube ER2220 Epoxy Resin
- Flame retardant
- Uses nonabrasive fillers
- Used for encapsulation of PCBs.
- Suitable for effective heat dissipation
- Provides environmental protection
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Electrolube ER2221 Epoxy Resin
- Improved thermal conductivity
- Low viscosity for a loaded system
- Contains no abrasive fillers
- Low wear and tear on dosing machinery
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Electrolube UR5608 Polyurethane Resin
- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available
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SILASTIC™ FL 60-9201 Fluoro Liquid Silicone Rubber (F-LSR)
- Two-component Fluoro Liquid Silicone Rubber (F-LSR) for liquid injection molding
- High resistance to fuels, oils and solvents
- Chemical and fluid resistance
- Fast-curing platinum technology, without by-products
- Curing over a wide temperature range
- High resistance to high temperatures

>120 min

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Araldite® CY 221 / Aradur® HY 2966

Araldite® XB 2252-1 / XB 2253-1

DOWSIL™ CN-8760 Thermally Conductive Encapsulant

DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit

DOWSIL™ Q3-6575 Dielectric Gel A/B Kit

Electrolube ER1122 Epoxy Resin

Electrolube ER2183 Epoxy Resin

Electrolube ER2188 Epoxy Resin

Electrolube ER2220 Epoxy Resin

Electrolube ER2221 Epoxy Resin

Electrolube UR5608 Polyurethane Resin

SILASTIC™ FL 60-9201 Fluoro Liquid Silicone Rubber (F-LSR)

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