>30 / <60 min
Showing all 7 results
Filtri
Tipo di prodotto
- 7 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
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- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
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- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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- Excellent resistance to seawater
- High toughness and tear resistance
- Good adhesion to most substrates
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- Soft, reworkable resin
- It can be "dug out"
- Flexible even in extreme temperatures
- Ideal for prototype circuits
- Replacement of silicone and control unit
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- High degree of toughness
- Adhesion to a wide variety of substrates
- Easy application
- Perfect where moisture ingress is a problem
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- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
