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7
Resins and encapsulants
Resins and encapsulants
Brands
Technology
Technology
Epoxy (1)
Polyurethane (3)
Silicone (3)
Applications
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Applications
Amplifiers (1)
Connectors (1)
Electronic Components (1)
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Araldite® CW 2243-1L
Low viscosity
Flexible jets
Good resistance to thermal shock
Semi-rigid system
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Reduces pressure on components
Effectively dissipates heat
Avoids delamination problems
The rapid polymerization
Optimized processing time
Allows for the implementation of complex projects
No additional dielectric barrier required
Allows for quick filling
It is suitable for high-throughput production processes.
Filling allows easy control of the process
Meets certification requirements
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
Two-component thermal conductive encapsulant
Suitable for PCB system
Protection in harsh environmental and thermal conditions
Can be used at room temperature
Used in the production of electrical products, PCBs and modules
Good adhesion to aluminum
Excellent dielectric properties
Good smoothness
Easy dispensing
Good flexibility for easy processing
Good adhesion without the use of primer
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Electrolube UR5041 Polyurethane Resin
Excellent resistance to seawater
High toughness and tear resistance
Good adhesion to most substrates
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Electrolube UR5044 Polyurethane Resin
Soft, reworkable resin
It can be "dug out"
Flexible even in extreme temperatures
Ideal for prototype circuits
Replacement of silicone and control unit
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Electrolube UR5528 Polyurethane Resin
High degree of toughness
Adhesion to a wide variety of substrates
Easy application
Perfect where moisture ingress is a problem
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SYLGARD™ 164 Silicone Elastomer Kit
Fast and versatile polymerization, controlled by temperature
Good dielectric properties
Moderate thermal conductivity
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