>30 / <60 min

Showing all 7 results

Tipo di prodotto

7 Resins and encapsulants Resins and encapsulants

Marchio

Tecnologia

Applicazioni

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

Read more Quick View
Araldite® CW 2243-1L
- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
Read more Quick View
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
Read more Quick View
DOWSIL™ TC-6020 Thermally Conductive Encapsulant
- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
Read more Quick View
Electrolube UR5041 Polyurethane Resin
- Excellent resistance to seawater
- High toughness and tear resistance
- Good adhesion to most substrates
Read more Quick View
Electrolube UR5044 Polyurethane Resin
- Soft, reworkable resin
- It can be "dug out"
- Flexible even in extreme temperatures
- Ideal for prototype circuits
- Replacement of silicone and control unit
Read more Quick View
Electrolube UR5528 Polyurethane Resin
- High degree of toughness
- Adhesion to a wide variety of substrates
- Easy application
- Perfect where moisture ingress is a problem
Read more Quick View
SYLGARD™ 164 Silicone Elastomer Kit
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity