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5 Resins and encapsulants Resins and encapsulants

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Technology

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Applications

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Arathane® CW 5620
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
- Two-component resin for high temperature
- It cross-links at room temperature but can be accelerated with heat
- Halogen-free system
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Arathane® Vb U 6912 P Polyol / Vb U001/B Isocian
- Polymerization at room temperature or moderate heat
- Easy castability and impregnation
- Mixing ratio 100:23 by weight
- Excellent electrical properties
- Absorbs sudden thermal shock
- Suitable for a low-stress encapsulant
- Halogen free
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Electrolube UR5118 Polyurethane Resin
- Excellent electrical properties
- Low dielectric constant
- Excellent resistance to seawater
- Very low viscosity
- Rugged and tear-resistant
- Low water absorption
- Excellent resistance to oxidation
- Excellent adhesion
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SYLGARD™ Q3-3600 Thermally Conductive Encapsulant
- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability