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Electronics adhesive
Electronics adhesive
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Technology
Technology
One-component silicone (13)
Two-component silicone (3)
Applications
Applications
Applications
5G base station (1)
Advanced cells (1)
Base plates (2)
Battery (3)
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Capacitors (1)
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Electrical Cables (3)
Electroconductive (1)
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Electronic Components (1)
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Printed circuit board PCB (11)
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Thermal interface (3)
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
Fluid
Hot polymerization
Good thermal conductivity values
No solvent added
Single-component - No need to mix separate components
Fast and versatile polymerization controlled by temperature
Fills and self-levels after dispensing
Heat dissipation from PCB systems to increase reliability
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DOWSIL™ 3140 RTV Coating
Single-component
Does not require mixing
Good fluidity
Capable of flowing, filling or self-leveling
Polymerization at room temperature
No solvent added
UV indicator for manual and automatic inspections
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DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
Mellow
High tensile strength and elongation resistance
High thermal stability
Single component - Does not require mixing
Polymerization at room temperature
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
Mellow
Polymerization in rapid RTV
Good "green" resistance
Single-component - No mixing required
Polymerization at room temperature
Fast skin time
High self-extinguishing
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DOWSIL™ 739 Plastic Adhesive
Mellow
High elongation by stress reduction
Single-component - No mixing required
Polymerization at room temperature
High self-extinguishing
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DOWSIL™ 744 RTV Adhesive Sealant
Cures at room temperature
Pasty consistency
It does not drip
Easy to apply
High elongation
Stable and flexible over a wide temperature range
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DOWSIL™ 866 Primerless Silicone Adhesive
Hot polymerization
High tensile strength
Single component - Does not require mixing
Fast and versatile curing with heat input fill or self-leveling after deployment
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DOWSIL™ 93-076 RF Aerospace Sealant
Good tensile strength High adhesive capacity Low thermal conductivity Good resistance to weathering Two-component with room temperature curing Stable even at high temperatures
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DOWSIL™ DA-6534 Adhesive
Low ionic impurities
Very high thermal conductivity
Loaded silver
Good adhesion to Ni, Al, laminate and silicon
Microelectronic grade material
High electroconductive performance
Good adhesive performance for TIM1 applications
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DOWSIL™ EC-6601 Electrically Conductive Adhesive
Electromagnetic shielding
Easy to dose and cure at room temperature
Dow's unique formulation enables adhesion to a variety of substrates
Durable mechanical and conductive properties, reliable performance
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DOWSIL™ Q5-8401 Adhesive
Two-component - Mixing ratio 1:1
Hot polymerization
High tensile strength
Good processing time after mixing
No solvent added
Fast and versatile polymerization controlled by temperature
Self-leveling
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DOWSIL™ SE 1700 Adhesive
Mellow
Two-component - 10:1 mixing ratio
High tensile strength
Good processing time after mixing
Hot polymerization
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DOWSIL™ SE 9120 S
Rapid polymerization in RT
Low viscosity
Controlled volatility of silicone
No solvent added
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DOWSIL™ SE 9185
Rapid polymerization in RT
Mellow
High elongation
Controlled volatility of silicone
Single-component - No mixing required
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DOWSIL™ SE 9186 Sealant
Volatility-controlled silicone
Polymerizes into a soft and elastic elastomer
No solvent added
Single-component - No mixing required
Polymerization at room temperature
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DOWSIL™ SE 9188 RTV Adhesive
Mellow
Controlled volatility of silicone
Single-component - No mixing required
Polymerization at room temperature
Self-extinguishing UL94 V-0
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