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Heat-conductive adhesive
Heat-conductive adhesive
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Heat-conductive adhesive
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Heat-conductive adhesive
Heat-conductive adhesive
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Technology
Silicon (10)
Applications
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Applications
Computer (1)
Connectors (1)
Consumer devices (1)
Desktop (1)
Electronic Components (1)
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Printed circuit board PCB (3)
Telecommunication devices (2)
Thermal interface (5)
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
Mixing ratio: 1 to 1
Highly fluent
Self-leveling
Versatile thermal polymerization
Ensures heat flow away from components
With 7 mil glass microspheres
Check the thickness of the adhesion line
Without added solvents
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DOWSIL™ 340 Heat Sink Compound
Not smooth
Moderate thermal conductivity
Does not require ovens or curing
Heat flow away from circuit components can increase reliability
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DOWSIL™ EA-9189 H White RTV Adhesive
No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
One-component adhesive
Thermally conductive
Polymerizes with moisture
Fast drying to the touch
Good adhesion
Self-leveling
Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9184 RTV Adhesive
Rapid polymerization in RT, without notches
Not smooth
Higher thermal conductivity
Controlled volatility of silicone
No mixing required
Polymerization at room temperature
Faster processing at room temperature
Used if increased flame resistance is required
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DOWSIL™ TC-4025 Dispensable Thermal Pad
Can be used as a printable PAD
Can replace the traditional manufactured pad
Use as a gap filler
Dispensed or printed through manual or automated processes
Deposit of features for precise coverage of components
Lower cost of ownership than manufactured pads
Excellent thermal performance
Soft, stress-relieving and shock-dampening
Reworkable
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DOWSIL™ TC-5026 Thermally Conductive Compound
Solvent-free formulation
Sliding
Does not polymerize
Able to achieve bond line thickness
Very low thermal resistance
High thermal conductivity
Wicks heat away from sensitive components
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DOWSIL™ TC-5080 Thermally Conductive Compound
Good thermal conductivity
Low oil bleed
Stable at high temperatures
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
Polymer matrix helps reduce pump out
Fluid
Good thermal conductivity
Low thermal resistance
Does not polymerize
Heat removal from PCB system components
Possible to obtain bond line thickness (BLT).
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DOWSIL™ TC-5622 Thermally Conductive Compound
Solvent-free formulation
Easy application
Low thermal resistance
High thermal conductivity
Good stability and reliability
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