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Thermal conductive paste
Thermal conductive paste
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Thermal conductive paste
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Thermal conductive paste
Thermal conductive paste
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Technology
Non-silicone (2)
Silicon (4)
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Battery (1)
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DOWSIL™ SC 102 Compound
Moderate thermal conductivity
One part: no ovens or curing required
Pulls heat away from critical components
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Electrolube HTC Heat Transfer Compound
Hot polymerization
High tensile strength
Single component - Does not require mixing
Fast and versatile curing with heat input fill or self-leveling after deployment
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Electrolube HTCP Non-Silicone Heat Transfer Compound Plus
High thermal conductivity
Optimal heat dissipation
Low viscosity for easy application
Used as thermal interface material
Based on a non-silicone oil
Avoids migration problems of silicone and siloxane LMW
Non-curing paste
Enables simple and efficient rework of components
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Electrolube HTS Silicone Heat Transfer Compound
General purpose thermal management paste
Excellent stability under a wide range of conditions
Silicone oil-based
Wide operating temperature range
Good thermal conductivity
Use as a thermal interface material
Non-curing paste
Allows rework of components
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Electrolube HTSP Silicone Heat Transfer Compound Plus
Thermal conductivity at elevated temperatures
Very low oil separation
Excellent anti-creep characteristics
Wide range of operating temperatures
Low evaporation weight loss
Optimal heat dissipation efficiency
Also facilitates application by screen printing
Non-hardening paste
Allows for easy rework
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Electrolube RTV Thermally Conductive Oxime
Increased adhesion strength
Can be used as a sealant or thermal adhesive
High thermal conductivity
Combines adhesive and heat dissipation properties
Very wide operating temperature range
Single-component
Not lumpy
Ideal if high viscosity product required
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