The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

DOWSIL™ 5888

  • Non-curing
  • High thermal conductivity
  • Low thermal resistance
  • Solvent-free formulation
  • Thixotropic – low flowability
  • Applicable via screen printing, stencil or dispensing
  • Ability to achieve thin thicknesses

Additional information

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Viscosity
Color
Thermal conductivity
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