100-1200 Pa·s

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses
    • Polymerization at room temperature
    • Good adhesion on various substrates
    • Fast tack-free time
    • Elastomeric material with high elongation
    • Suitable for bonding, sealing and thermal dissipation
    • Good mechanical strength