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<100,000 mPa.s
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<100,000 mPa.s
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
Mixing ratio: 1 to 1
Highly fluent
Self-leveling
Versatile thermal polymerization
Ensures heat flow away from components
With 7 mil glass microspheres
Check the thickness of the adhesion line
Without added solvents
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DOWSIL™ SC 102 Compound
Moderate thermal conductivity
One part: no ovens or curing required
Pulls heat away from critical components
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
Polymer matrix helps reduce pump out
Fluid
Good thermal conductivity
Low thermal resistance
Does not polymerize
Heat removal from PCB system components
Possible to obtain bond line thickness (BLT).
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DOWSIL™ TC-5622 Thermally Conductive Compound
Solvent-free formulation
Easy application
Low thermal resistance
High thermal conductivity
Good stability and reliability
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MG Chemicals 842AR
Provides superior EMI shielding
Excellent adhesion to plastics
Minimum height of thin layer
Strong corrosion resistance
Gentle solvent system, safe on polystyrenes
HAP-free: does not contain toluene, xylene or MEK
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MG Chemicals 842ER
Upper EMI shielding
Polymerization at room temperature and high
Excellent chemical and corrosion resistance
Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
Resists wave soldering
Without MEK and HAPS
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MG Chemicals 9410
High electrical conductivity
Creates strong permanent electrical connections
No mixing is required
Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
Storage at room temperature (≤ 22 °C)
Suitable for automated distribution
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