<100,000 mPa.s
Showing all 7 results
Filtri
Tipo di prodotto
- 1 Electrically conductive adhesives
- 3 Heat-conductive adhesive
- 1 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
-
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
-
- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
-
- Polymer matrix helps reduce pump out
- Fluid
- Good thermal conductivity
- Low thermal resistance
- Does not polymerize
- Heat removal from PCB system components
- Possible to obtain bond line thickness (BLT).
-
- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
-
- Provides superior EMI shielding
- Excellent adhesion to plastics
- Minimum height of thin layer
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene, xylene or MEK
-
- Upper EMI shielding
- Polymerization at room temperature and high
- Excellent chemical and corrosion resistance
- Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
- Resists wave soldering
- Without MEK and HAPS
-
- High electrical conductivity
- Creates strong permanent electrical connections
- No mixing is required
- Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
- Storage at room temperature (≤ 22 °C)
- Suitable for automated distribution
