<100,000 mPa.s

Showing all 7 results

Tipo di prodotto

1 Electrically conductive adhesives Electrically conductive adhesives
3 Heat-conductive adhesive Heat-conductive adhesive
1 Thermal conductive paste Thermal conductive paste

Marchio

Tecnologia

Applicazioni

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ SC 102 Compound
- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
- Polymer matrix helps reduce pump out
- Fluid
- Good thermal conductivity
- Low thermal resistance
- Does not polymerize
- Heat removal from PCB system components
- Possible to obtain bond line thickness (BLT).
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DOWSIL™ TC-5622 Thermally Conductive Compound
- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
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MG Chemicals 842AR
- Provides superior EMI shielding
- Excellent adhesion to plastics
- Minimum height of thin layer
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene, xylene or MEK
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MG Chemicals 842ER
- Upper EMI shielding
- Polymerization at room temperature and high
- Excellent chemical and corrosion resistance
- Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
- Resists wave soldering
- Without MEK and HAPS
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MG Chemicals 9410
- High electrical conductivity
- Creates strong permanent electrical connections
- No mixing is required
- Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
- Storage at room temperature (≤ 22 °C)
- Suitable for automated distribution