Silicones and new electronic protection technologies:
MATERIALS, PROCESSES AND APPLICATIONS

Download the technical guide on silicones and discover the Low Pressure Molding solution for electronic component protection. Complete the form to access the content, request a Low Pressure Molding demo, and obtain your ticket for Focus on PCB 2026.

Request content and trade show ticket

We will be present at Focus on PCB Vicenza 2026 – Hall 7 | Stand C44/D43

A single access point to content, technologies, and technical discussion

PCB reliability, stability, and performance depend not only on design, but on the choice of materials and how they are applied.

By completing the form, you gain access to a package designed for those who truly work on electronic device protection:

This is not a collection of materials, but content designed to support design and process decisions.

Technical guide on silicones for electronicsIn-depth analysis of new encapsulation technologiesOpportunity for discussion with Mascherpa techniciansTicket for Focus on PCB 2026
Conformal coating PCB

The importance of silicone in electronic device manufacturing

Silicone materials are often considered one choice “among others.” In reality, they become central when operating conditions begin to be variable or critical.

The technical guide addresses a central issue: how to ensure protection and reliability over time. Inside you will find:

  • differences between silicones and alternative materials
  • behavior under thermal and environmental stress
  • resistance to humidity, vibrations, and chemical agents
  • selection criteria based on application.

Low Pressure Molding: a new technology for electronic device protection

Alongside silicones, Mascherpa introduces a new solution: Low Pressure Molding, based on hot melt polymers. This technology allows for the encapsulation of electronic components in a fast, controlled, and repeatable manner.

A different approach compared to potting and traditional solutions, useful when there is a need to simplify the process and reduce components and steps.

Polymer and machine: the complete system

The difference of this technology lies in the integration between material and process.

Hot melt polymers developed by SIPOL

  • protection from water, dust, vibrations, and thermal stress
  • high chemical and mechanical resistance
  • insulating properties and stability over time
  • direct molding capability on PCB
  • single-component thermoplastic adhesive

LPM system by TECNO INCOLLAGGI (Tecnostar)

  • high-precision volumetric gear pump for process control
  • complete parameter management via PLC
  • reduced resin oxidation inside the melter
  • no color alteration
  • waste reduction and greater product stability
  • reduced cycle times and lower energy consumption

The result is an integrated system that combines material and process. Book a demonstration at the trade show or contact us for more information.

Focus on PCB 2026: direct discussion on materials and processes

Mascherpa will be present at Focus on PCB 2026 to bring this content into an application context. An opportunity to see technologies applied and discuss real cases.
📍 Vicenza
📅 May 13-14, 2026
📌 Hall 7 - Stand C44/D43
Partner Cabiotec will also be present at the stand, with solutions for:
automated optical inspection (AOI)
X-ray analysis
digital microscopy
PCB washing

Request trade show ticket

Mascherpa: experience and content for electronics

For over 120 years, Mascherpa has supported companies in the selection and application of materials, always starting from the real application: operating conditions, potential critical issues, and process consistency.

Participation in Focus on PCB 2026 is part of a journey built over time. In previous editions, we explored topics such as PCB integrity and conformal coating application errors, turning them into practical technical content. You can download the other technical guides below:

PCB Integrity Protection

Avoid Conformal Coating Errors

Today you can continue to explore electronic protection solutions by consulting our experts’ videos and viewing real applications in NEXT partnerships.

What you get by completing the form

Technical content, new technologies, and the opportunity for direct discussion in a single request.

  1. Technical guide on silicones for electronics
  2. In-depth analysis of Low Pressure Molding
  3. Opportunity for technical discussion
  4. Trade show access

Complete the form to receive the guide, request a discussion, and obtain your ticket for the trade show.