Silicones and new electronic protection technologies:
MATERIALS, PROCESSES AND APPLICATIONS
Download the technical guide on silicones and discover the Low Pressure Molding solution for electronic component protection. Complete the form to access the content.
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A single access point to content, technologies, and technical discussion
PCB reliability, stability, and performance depend not only on design, but on the choice of materials and how they are applied.
By completing the form, you gain access to a package designed for those who truly work on electronic device protection:
This is not a collection of materials, but content designed to support design and process decisions.
The importance of silicone in electronic device manufacturing
Silicone materials are often considered one choice “among others.” In reality, they become central when operating conditions begin to be variable or critical.
The technical guide addresses a central issue: how to ensure protection and reliability over time. Inside you will find:
- differences between silicones and alternative materials
- behavior under thermal and environmental stress
- resistance to humidity, vibrations, and chemical agents
- selection criteria based on application.
Low Pressure Molding: a new technology for electronic device protection
Alongside silicones, Mascherpa introduces a new solution: Low Pressure Molding, based on hot melt polymers. This technology allows for the encapsulation of electronic components in a fast, controlled, and repeatable manner.
A different approach compared to potting and traditional solutions, useful when there is a need to simplify the process and reduce components and steps.
Polymer and machine: the complete system
The difference of this technology lies in the integration between material and process.
Hot melt polymers developed by SIPOL
- protection from water, dust, vibrations, and thermal stress
- high chemical and mechanical resistance
- insulating properties and stability over time
- direct molding capability on PCB
- single-component thermoplastic adhesive
LPM system by TECNO INCOLLAGGI (Tecnostar)
- high-precision volumetric gear pump for process control
- complete parameter management via PLC
- reduced resin oxidation inside the melter
- no color alteration
- waste reduction and greater product stability
- reduced cycle times and lower energy consumption
The result is an integrated system that combines material and process. Contact us for more information.
Mascherpa: experience and content for electronics
For over 120 years, Mascherpa has supported companies in the selection and application of materials, always starting from the real application: operating conditions, potential critical issues, and process consistency.
Avoid Conformal Coating Errors
Today you can continue to explore electronic protection solutions by consulting our experts’ videos and viewing real applications in NEXT partnerships.
What you get by completing the form
Technical content, new technologies, and the opportunity for direct discussion in a single request.
- Technical guide on silicones for electronics
- In-depth analysis of Low Pressure Molding
- Opportunity for technical discussion
Complete the form to obtain the technical guide and arrange a direct consultation.
