PCB printed circuit boards
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- Black, flexible two-part epoxy compound
- Designed to reduce physical stress on components
- Suitable for low-temperature environments and applications subject to thermal cycling or rapid temperature changes
- Mixing ratio 1:1 by volume
- Very low mixed viscosity of 700 cP
- Good adhesion to metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulation properties
- High resistance to water and moisture, even when submerged
- Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
- Solvent-free
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- Black, rigid two-part epoxy resin
- PCB potting compound
- Capable of filling small gaps and cavities
- Mixing ratio 1:1 by volume
- Low mixed viscosity of 4,100 cP
- High compressive and tensile strength
- Excellent adhesion to metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulation properties
- High resistance to water and humidity
- Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
- Solvent-free
- Room temperature or heat-accelerated curing
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- Black two-component thermally conductive epoxy resin
- Designed for applications where thermal management is a critical factor
- Thermal conductivity of 0.68 W/(m·K)
- Low exotherm
- Mixing ratio 1:1 by volume
- High compressive and tensile strength
- Excellent adhesion to metals, composites, glass, ceramics and numerous plastics
- Excellent electrical insulation properties
- High resistance to water and humidity
- Protection from electrostatic discharge, vibration, abrasion, thermal shock, moisture, salt water, fungus and aggressive chemicals
- Solvent-free



