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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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ARALDITE® 1570 FST A/B
- Two-component epoxy adhesive
- Halogen-free
- Compliant with FST (Flame, Smoke, Toxicity) requirements
- Self-extinguishing
- Thixotropic paste formulation
- Room temperature curing
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ARALDITE® 1641 A/B
- Ultra-low density syntactic epoxy adhesive
- Easily pumpable
- Non-sag after application
- Good resistance to vibrational fatigue
- Designed to reduce cracking tendency in high-stress applications
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ARALDITE® 1644 A/B
- Ultra-low density syntactic epoxy adhesive
- Non-sag
- Designed for edge sealing and void filling
- High compressive strength-to-density ratio
- Manual or extrusion application
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ARALDITE® 40002/40003
- Two-component epoxy system
- FST Properties (Fire, Smoke, Toxicity)
- Intrinsically flame retardant
- Low viscosity for infusion and RTM processes
- Heat curing
- High mechanical performance
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ARALDITE® 501 A/B
- Two-component epoxy adhesive
- Low-viscosity system
- Good substrate wetting
- Room temperature curing
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ARALDITE® LY 1564 SP / ARADUR® 2954
- Two-component epoxy system for composites
- Amine system without reactive diluents
- High flexibility and high reactivity
- Suitable for hot processes
- Good reinforcement impregnation
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ARALDITE® LY 3508 / ARADUR® 22962
- Toughened two-component epoxy system
- Medium resin viscosity
- Good toughness combined with low viscosity
- Suitable for lamination and molding processes
- Heat curing
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ARALDITE® LY 3508 / ARADUR® 3475
- Two-component epoxy system
- Medium-viscosity toughened resin
- Good toughness and mechanical strength
- Suitable for lamination and molding processes
- Heat curing
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ARALDITE® LY 5052 / ARADUR® 5052
- Two-component low-viscosity epoxy system
- Long pot life
- Good reinforcement impregnation
- Room temperature curing with post-cure capability
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ARALDITE® LY 8615 / ARADUR® 8615
- Two-component high-temperature epoxy system
- Low viscosity for RTM, SCRIMP, and VARTM processes
- Long pot life
- High glass transition temperature (Tg > 180 °C with post-cure)
- Suitable for the production of composite parts and molds
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CG 1305 A/B
- Two-component syntactic epoxy system
- Medium density and low specific weight
- High mechanical strength
- Pourable
- Designed for honeycomb structure reinforcement and potting
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DOWSIL™ 3-6548 Silicone RTV Foam
- Two-component fire-resistant RTV silicone foam
- Two-component room temperature vulcanizing (RTV) silicone foam
- Fire resistant
- Good flexibility even under severe operating conditions
- Withstand high temperatures
- Designed to limit hazards such as smoke, flames and gases.
- Expands and cures at room temperature to form a closed-cell foam elastomer.
- Designed for creating fire-resistant seals in penetrations and linear joints.
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DOWSIL™ 866 Primerless Silicone Adhesive
- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
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DOWSIL™ 93-076 RF Aerospace Sealant

Good tensile strength High adhesive capacity Low thermal conductivity Good weather resistance Two-component with room temperature curing Stable even at high temperatures
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DOWSIL™ DA-6534 Adhesive
- Low ionic impurities
- Very high thermal conductivity
- Loaded silver
- Good adhesion to Ni, Al, laminate and silicon
- Microelectronic grade material
- High electroconductive performance
- Good adhesive performance for TIM1 applications
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DOWSIL™ EC-6601 Electrically Conductive Adhesive
- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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DOWSIL™ EG-1200 Gel
- Gel is a two-component addition-cure silicone gel
- Clear and flowable,
- Designed for optically clear potting and coupling applications in displays and LED lighting systems.
- High transparency
- Reduced yellowing
- High surface adhesion
- Good stress absorption capacity
- Provides mechanical protection, electrical insulation and long-term reliability.
- Can cure at room temperature or with thermal acceleration.
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DOWSIL™ Q5-8401 Adhesive
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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DOWSIL™ SE 1700 Adhesive
- Mellow
- Two-component - 10:1 mixing ratio
- High tensile strength
- Good processing time after mixing
- Hot polymerization
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DOWSIL™ SE 9120 S
- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added