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Electronics adhesive
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Resins and encapsulants
Resins and encapsulants
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One-component silicone (13)
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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
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DOWSIL™ Q5-8401 Adhesive
Two-component - Mixing ratio 1:1
Hot polymerization
High tensile strength
Good processing time after mixing
No solvent added
Fast and versatile polymerization controlled by temperature
Self-leveling
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DOWSIL™ SE 1700 Adhesive
Mellow
Two-component - 10:1 mixing ratio
High tensile strength
Good processing time after mixing
Hot polymerization
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DOWSIL™ SE 9120 S
Rapid polymerization in RT
Low viscosity
Controlled volatility of silicone
No solvent added
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DOWSIL™ SE 9185
Rapid polymerization in RT
Mellow
High elongation
Controlled volatility of silicone
Single-component - No mixing required
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DOWSIL™ SE 9186 Sealant
Volatility-controlled silicone
Polymerizes into a soft and elastic elastomer
No solvent added
Single-component - No mixing required
Polymerization at room temperature
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DOWSIL™ SE 9188 RTV Adhesive
Mellow
Controlled volatility of silicone
Single-component - No mixing required
Polymerization at room temperature
Self-extinguishing UL94 V-0
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EPIBOND® 115 A/B
High-temperature structural epoxy adhesive
Two-component epoxy adhesive
Service up to 149°C (300°F)
High shear strength on metals and composites
Thixotropic gap-filling paste
Contains 125-micron spacer beads
High Tg
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EPIBOND® 215 A/B
High-strength structural epoxy adhesive
High shear and peel strength
Gap-filling with thixotropic behavior
Polymerization at room temperature
Fast handling strength
Good performance retention after environmental aging and chemical immersion
SVHC-free according to REACH
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EPIBOND® 420 A/B
Structural applications
Room temperature curing paste
High toughness and resilience
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EPOCAST® 1614-A3
Syntactic structural epoxy adhesive
Single-component supplied frozen
Paste consistency after thawing
Extrudable with standard equipment
Designed for structural applications on honeycomb
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EPOCAST® 1617 A/B
Two-component structural epoxy adhesive
Low-density syntactic formulation
Good mechanical strength-to-density ratio
Suitable for structural applications
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EPOCAST® 1618 D/B
Low density syntactic epoxy adhesive
Flame retardant and self-extinguishing
Extrudable but non-sagging after application
Fast curing at room temperature
Suitable for potting inserts in honeycomb structures
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EPOCAST® 1619-1 A/B
Low density syntactic epoxy adhesive
Flame retardant and self-extinguishing
Extrudable but non-sagging after application
Fast curing at room temperature
Suitable for potting inserts in honeycomb structures
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EPOCAST® 1626 C1/D2
Two-component structural epoxy adhesive
Low-density syntactic formulation
Designed for structural applications on sandwich panels
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EPOCAST® 1628 A/B
Ultra-low density epoxy paste
Flame retardant
Extrudable and non-sagging
Sandable and machinable after curing
Suitable for edge reinforcement and honeycomb structure filling
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EPOCAST® 1629 A/B
Ultra-low density epoxy syntactic paste
Self-extinguishing
Paste/putty consistency with good stability on vertical surfaces
Sandable and machinable after curing
Applicable for edge reinforcement of honeycomb structures
Slump-resistant
PBDE-free
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EPOCAST® 1635 A/B
Two-component syntactic epoxy adhesive
Aluminum-filled
Designed for repairing misdrilled holes in composite parts
High compressive strength
High dynamic fatigue resistance under load
Usable up to 177 °C
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Epocast® 1636-A/B
High-performance two-component system with high strength and good high-temperature resistance
Aluminum-filled, medium viscosity, easy to handle
Mechanically workable (easily machined after curing)
Self-extinguishing
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EPOCAST® 1645 FR A/B
Ultra-low density structural syntactic paste
Flame retardant, compliant with FAR 25.853a requirements
Compliant with BMS 5-28 Type 9
Self-extinguishing
Easily hand-mixable
Non-tacky
Sandable after curing
Suitable for structural reinforcement of sandwich panels
Suitable for aerospace use
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EPOCAST® 1648 A/B
Two-component structural epoxy adhesive
Low-density syntactic formulation
Non-sag after application
Suitable for structural reinforcement applications
Sandable after complete polymerization
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