Siliconic
Showing 41–47 of 47 results
Filtri
Tipo di prodotto
- 16 Electronics adhesive
- 1 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
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- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Non-sag after application
- Suitable for structural reinforcement operations
- Sandable after curing
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- Low density syntactic epoxy adhesive
- Dense paste consistency
- High compressive strength
- Good high temperature performance after room temperature cure
- Suitable for core filling, stiffness enhancement and structural reinforcement
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- Unfilled two-component epoxy system
- Solvent-free
- Easy to process
- High mechanical strength
- Flame retardant
- Long pot life
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- Two-component epoxy system for structural repairs
- Designed for aerospace composite repairs
- Good hot/wet resistance
- Resistant to fuels, hydraulic fluids, oils, and moisture
- Supplied in pre-measured resin + hardener kits
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- Two-component epoxy system
- Unfilled and solvent-free
- High mechanical strength
- Self-extinguishing
- Short pot life
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- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
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- Two-component polyurethane system
- Suitable for industrial applications
- Liquid formulation
