Siliconic

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Marchio

Tecnologia

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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DOWSIL™ DA-6534 Adhesive
- Low ionic impurities
- Very high thermal conductivity
- Loaded silver
- Good adhesion to Ni, Al, laminate and silicon
- Microelectronic grade material
- High electroconductive performance
- Good adhesive performance for TIM1 applications
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DOWSIL™ EC-6601 Electrically Conductive Adhesive
- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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DOWSIL™ Q5-8401 Adhesive
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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DOWSIL™ SE 1700 Adhesive
- Mellow
- Two-component - 10:1 mixing ratio
- High tensile strength
- Good processing time after mixing
- Hot polymerization
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DOWSIL™ SE 9120 S
- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
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DOWSIL™ SE 9185
- Rapid polymerization in RT
- Mellow
- High elongation
- Controlled volatility of silicone
- Single-component - No mixing required
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DOWSIL™ SE 9186 Sealant
- Volatility-controlled silicone
- Polymerizes into a soft and elastic elastomer
- No solvent added
- Single-component - No mixing required
- Polymerization at room temperature
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DOWSIL™ SE 9188 RTV Adhesive
- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0
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EPIBOND® 115 A/B
- High-temperature structural epoxy adhesive
- Two-component epoxy adhesive
- Service up to 149°C (300°F)
- High shear strength on metals and composites
- Thixotropic gap-filling paste
- Contains 125-micron spacer beads
- High Tg
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EPIBOND® 200 A/B
- Flexible epoxy structural adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Good performance retention after environmental aging
- 1:1 mixing ratio by weight and volume
- SVHC-free according to REACH
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EPIBOND® 215 A/B
- High-strength structural epoxy adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Fast handling strength
- Good performance retention after environmental aging and chemical immersion
- SVHC-free according to REACH
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EPIBOND® 315 A/B
- Two-component epoxy adhesive
- Pasty consistency
- High mechanical strength
- Good adhesion to metals
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EPIBOND® 420 A/B
- Structural applications
- Room temperature curing paste
- High toughness and resilience
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EPIBOND® 8000 FR A/B
- Structural epoxy adhesive, flame retardant
- Self-extinguishing properties according to FAR 25.853
- High shear and peel strength
- Thixotropic gap-filling paste
- Curable from room temperature to elevated temperatures
- Free of halogenated additives and antimony
- No SVHC according to REACH
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EPOCAST® 1614-A3
- Syntactic structural epoxy adhesive
- Single-component supplied frozen
- Paste consistency after thawing
- Extrudable with standard equipment
- Designed for structural applications on honeycomb
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EPOCAST® 1617 A/B
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Good mechanical strength-to-density ratio
- Suitable for structural applications
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EPOCAST® 1618 D/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures
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EPOCAST® 1619-1 A/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures
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EPOCAST® 1626 C1/D2
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Designed for structural applications on sandwich panels
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EPOCAST® 1627-2
- High-performance structural syntactic epoxy, filled, for core reinforcement
- Extremely low coefficient of thermal expansion
- Supplied as frozen patty or Semco cartridge, ready to use after thawing (no weighing or mixing)
- High compressive strength